Thermal characterization of tri-ethylene glycol dimethacrylate was carried out in view of its vast applications. The main objective of this paper is to investigate the thermal behaviour of the impurities present in the compound triethylene glycol di-methacrylate and its effects during applications of the compound. Thermal characterisation was carried out under two different experimental conditions. One at low heat flux rate of 10degreesC/min, and another at higher heat flux rate of 100degreesC/min. At low heat flux rate, the ethers present as impurities in the compound tri-ethylene glycol dimethacrylate are stable below the temperature of 150degreesC. This is desirable for applications in anaerobic adhesive and optical articles where exposure to temperature beyond 150degreesC is not required. At higher heating rate of 100degreesC/min, the endothermic decomposition of the impurities as ethers present in the compound tri-ethylene glycol di-methacrylate is observed, and the same is desired from the application point of view of using tri-ethylene glycol di-methacrylate as a moderant in single base propellants.