The surface of polyether ether ketone (PEEK) films was modified using plasma treatment, corona, or surface etching to improve their adhesion with regard to glued copper foils and copper layers generated by physical vapor deposition. After the pretreatments, surface chemical analysis was performed by X-ray photoelectron spectroscopy (XPS). The wetting behavior was qualitatively investigated by contact angle measurements. Surface topography was monitored by laser scanning microscopy (LSM). After coating, the adhesion strength of the copper layer was measured by a peel force test. Plasma treatment, corona discharge, or etching lead to a significant increase in adhesion. This increase is caused by a change in surface topography as well as by the incorporation of polar groups into the surface.