Kissing bonds are interfacial defects in which the substrate and adhesive are in intimate contact or couple through a weak bond or a thin layer of contaminant. In this study, the kissing bonds were produced by applying a low voltage to bonded specimens with an electrically disbonding adhesive, ElectRelease. The results from field emission scanning electron microscopy (FESEM), combined with energy dispersive X-ray spectroscopy (EDS) analysis, indicated morphological changes that were observed at, or near, the weakened hardened steel/ElectRelease interface while chemical changes were determined at the interface and also within the adhesive after the application of a voltage. The adhesive chemistry and its curing mechanisms were better understood using Raman spectroscopy. A shift of a Raman peak to a higher wave number confirmed the results from EDS and could explain the weakening mechanisms at such interface and/or interphase. A considerable reduction in joint strength from mechanical testing for the joints subjected to the electric field was found.