In many aerospace applications, the use of film and paste adhesive materials is not conducive to either good manufacturability or good bonding properties. To address this concern, the development of high-performance, epoxy-based, spray-adhesive resins has been undertaken from a research and development standpoint. These materials were investigated in the light of their potential repair applications, with focus on adhesive joint designs based on lap-shear performance and processibility of the adhesive. It was found that the resins investigated displayed adequate lap-shear strengths for the bond types of interest. However, some resins proved to be a considerable challenge during processing and solvent removal presented a problem for some materials. As expected, the combined use of mechanical testing and scanning electron microscopy revealed that the lap-shear strengths of the resins could be tailored with changes in their chemistry, and that these changes also affected the solvent removal process.