We have developed a semi-empirical model capable of quantitatively estimating delamination rates (DRs) of adhesive bonds upon exposure to cathodic environments. The equations used in this model are derived from physical considerations that account for variables which influence the DRs: cathodic voltage (implicitly current density), temperature and peel stress (utilizing strain energy release rate, G, as a fracture mechanics parameter). In the model equations, the constants are determined by fitting these equations to experimentally collected delamination data. Nomograms are developed that can be easily consulted in order to determine DRs under a multitude of cathodic polarization, temperature, and strain energy release rate, G. This semiempirical model can serve as a first-order predictor of cathodic delamination rates of adhesive bonds under a variety of cathodic conditions (including some which are highly accelerated). (C) Koninklijke Brill NV, Leiden, 2008.