This study focuses on the fabrication, for power electronics applications, of adaptive heat sink material using copper alloys/carbon fibers (CF) composites. In order to obtain composite material with good thermal conductivity and a coefficient of thermal expansion close to the ceramic substrate, it is necessary to have a strong matrix/reinforcement bond. Since there is no reaction between copper and carbon, a carbide element (chromium or boron) is added to the copper matrix to create a strong chemical bond. Composite materials (Cu-B/CF and Cu-Cr/CF) have been produced by a powder metallurgy process followed by an annealing treatment in order to create the carbide at the interphase. Chemical (Electron Probe Micro-Analysis, Auger Electron Spectroscopy) and microstructural (Scanning and Transmission Electron Microscopies) techniques were used to study the location of the alloying element and the carbide formation before and after diffusion. Finally, the thermo-mechanical properties have been measured and a promising composite material with a coefficient of thermal expansion 25% lower than a classic copper/carbon heat sink has been obtained. (C) 2011 Elsevier Ltd. All rights reserved.