Curing agents composed of 60, 70 or 80% of 4,4'-diaminodiphenylmethane (l) and 40, 30, or 20% of waste (3,5- +3,6-)toluenediamines, resp., were mixed, 30, 25 or 22 wt. pts., with 100 wt. pts of epoxy resin Epidian 7, 6, or 5 and 12, 0, or 15 wt. pts. of ethylene glycol diglycidyl ether as active diluent, resp., and cured 5 h at 60degreesC and 1 h at each temp. of 100, 120 and 150degreesC. For the resulting compositions, Martens heat-deflection and glass-transition temps. (scanned over 20-250degreesC at 10degrees/min), viscosities at 30, 40 and 60degreesC, the real shear modulus (G), the log decrement, and tan delta (mech. loss modulus) were determined. The liquidus curves measured in (a) l-(2,4- + 2,6-)toluenediamines (eutectic: 35% l, 55degreesC) and (b) l-(3,5- + 3,6-) toluenediamines pseudobinary systems showed the b-system to be liquid. at 20degreesC over 60-80% l. The best processing temperature was 40degreesC. At <120&DEG;C, each composition could be used in rigid constructions. The Epidian 7 composition changed Us mechanical properties by 4% only at &SIM;150&DEG;C. Waste 3,5- and 3,6-toluenediamines made the compositions more heat resistant.