Journal of Applied Polymer Science, Vol.65, No.5, 861-869, 1997
Bis(3-Aminophenyl) Methyl Phosphine Oxide-Based (Methyl) Nadicimide Resins
Ten nadicimide/methyl nadicimide end-capped oligomeric resins were prepared by reacting endo-5-norbornene-2,3-dicarboxylic acid anhydride (methyl nadic anhydride), pyromellitic dianhydride (PMDA)/3,3’,4,4’-benzophenone tetracarboxylic acid dianhydride (BTDA)/2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6F), and bis(3-aminophenyl) methyl phospine oxide(BAP) in glacial acetic acid/acetone. Structural characterization of the resins was done by elemental analysis, IR, and H-1-NMR. Multistep decomposition was observed in the TG scan of uncured resins in a nitrogen atmosphere. Residual weight at 800 degrees C depended on the structure and ranged between 25 and 51%. Isothermal curing of the resins was done at 300 degrees C for 1 h in an air atmosphere. These cured resins were stable to 350 +/- 30 degrees C and decomposed in a single step above this temperature. The char yield of the resins increased on curing and was in the range 34-70%.