Thin Solid Films, Vol.518, No.14, 3837-3843, 2010
Three-dimensional finite element analysis of fracture modes for the pull-off test of a thin film from a stiff substrate
A three-dimensional geometrically nonlinear finite element analysis model is presented to study the interfacial delamination for the pull-off test of a thin film strip debonded from a stiff substrate. The strain energy release rates of all three modes (mode I, mode II, and mode III) along the debond front are considered and calculated to investigate the mixed fracture modes for the entire deformation regime from bending plate to stretching membrane. These results indicate that the individual strain energy release rates and the total energy release rate vary along the width of the debond front and strong three-dimensional edge effects exist near the free edges of the film. Interestingly, residual stress also plays an important role in controlling mixed fracture modes and the variation of the energy release rates. Finally, the three-dimensional finite element model is compared with an analytical solution developed earlier. The three-dimensional finite element model is found to provide additional insights for interfacial delamination for the pull-off test. (C) 2009 Elsevier B.V. All rights reserved.
Keywords:Pull-off test;Strain energy release rate;Fracture modes;Adhesion test;Finite element analysis