We present a versatile method to create self-aligned patterns of polymer dielectric on metal by the use of Joule heating. In contrast to global thermal or light based curing, the method self-aligns the dielectric to a metal pattern on the substrate. A current-induced temperature rise along a metal line cures the insulator locally; uncured material is then removed by rinsing with solvent. We have obtained very promising results for aligning thermally cross-linkable and selectively baked dielectrics. Alignment of cross-linkable polymers is less sensitive to the rinsing step than selectively baked dielectrics. Finite-element simulations were used to determine the range of suitable curing current. After optimization of the curing parameters high yield and low leakage dielectrics were obtained. (C) 2011 Elsevier B.V. All rights reserved.