Thin Solid Films, Vol.520, No.7, 2868-2872, 2012
Preparation of porous alumina abrasives and their chemical mechanical polishing behavior
Porous alumina abrasives with different pore sizes were prepared using hydrothermal synthesis method by different hydrothermal temperatures. The pore structure, pore size and pore volume of the products were characterized by transmission electron microscopy and nitrogen adsorption desorption isotherm measurement. The chemical mechanical polishing (CMP) performances of porous alumina abrasives in hard disk substrate CMP were investigated. The results show that, the polished surface average roughness (Ra) decreases when the pore diameter of porous alumina abrasive increases. By comparison with solid alumina abrasive, the prepared porous alumina abrasives give lower Ra, and the porous alumina abrasive with 8.61 nm pore diameter has higher material removal rate under the same polishing conditions. (C) 2011 Elsevier B.V. All rights reserved.
Keywords:Chemical mechanical polishing (CMP);Porous alumina abrasive;Hard disk substrate;Planarization