The growth and morphology of copper phthalocyanine on TiO2 nanotube arrays

Sung Ha Ju; Sanghyun Han; Jeong Soo Kim

Journal of Industrial and Engineering Chemistry, Vol.19, No.1, 272-278, January, 2013

DOI10.1016/j.jiec.2012.08.011 Export Citation

The growth and morphology of copper phthalocyanine on TiO2 nanotube arrays

Sung Ha Ju, Sanghyun Han, and Jeong Soo Kim^{1, †}

Department of Polymer Science and Engineering, Chungnam National University, 99 Daehack-ro, Daejeon 305-764, South Korea
¹Graduate School of Green Energy Technology, 99 Daehack-ro, Daejeon 305-764, South Korea

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Nanostructured copper phthalocyanine was deposited by thermal vacuum evaporation, spin-coating, immersion, and electrochemical reactions onto titania nanotubes prepared by the anodization of titanium foil so as to attain interdigited heterojunctions between them for improved interfacial contact. The effects of the titania’s crystal structure on the deposition were analyzed. A sodium salt derivative of copper phthalocyanine was used to enhance its affinity to the titania. The deposited copper phthalocyanine could be grown and transformed into diverse morphologies such as polyhedrons, nanorods, and nanowires. The factors affecting the morphology of the deposited copper phthalocyanine were analyzed by SEM and crystal structure analysis.

Keywords:Deposition;Interdigited structure;Titania nanotube;Copper phthalocyanine;Heterojunction;Morphology

[References]

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Gunes S, Neugebauer H, Sariciftci NS, Chem. Rev., 107(4), 1324 (2007)
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Claessens CG, Hahn U, Torres T, Chemical Record., 8, 75 (2008)
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Ouyang M, Bai R, Yang L, Chen Q, Han Y, Wang M, Yang Y, Chen H, Journal of Physical Chemistry C., 112, 2343 (2008)
Kim SM, Cho KK, Kim KW, Ryu KS, Journal of Korean Powder Metallurgy Institute., 17, 216 (2010)
Macak JM, Hildebrand H, Marten-Jahns U, Schmuki P, Journal of Electroanalytical Chemistry., 621, 254 (2008)
Park NG, van de Lagemaat J, Frank AJ, J. Phys. Chem. B, 104(38), 8989 (2000)
Xi HX, Wei ZM, Duan ZM, Xu W, Zhu DB, Journal of Physical Chemistry C., 112, 19934 (2008)
Karak S, Ray SK, Dhar A, Journal of Physics D: Applied Physics., 43, 245101 (2010)
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[Referenced By]

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[1] Sariciftci NS, Smilowitz L, Heeger AJ, Wudl F, Science., 258, 1474 (1992)

[2] Yu G, Gao J, Hummelen JC, Wudl F, Heeger AJ, Science, 270(5243), 1789 (1995)

[3] Gunes S, Neugebauer H, Sariciftci NS, Chem. Rev., 107(4), 1324 (2007)

[4] Macak JM, Schmidt-Stein F, Schmuki P, Electrochemistry Communications., 9, 1783 (2007)

[5] Paulose M, Varghese OK, Mor GK, Grimes CA, Ong KG, Nanotechnology., 17, 398 (2006)

[6] Onoda K, Ngamsinlapasathian S, Fujieda T, Yoshikawa S, Sol. Energy Mater. Sol. Cells, 91(13), 1176 (2007)

[7] Hoyer P, Langmuir, 12(6), 1411 (1996)

[8] Jung JH, Kobayashi H, van Bommel KJC, Shinkai S, Shimizu T, Chemistry of Materials., 14, 1445 (2002)

[9] Tian ZRR, Voigt JA, Liu J, McKenzie B, Xu HF, J. Am. Chem. Soc., 125(41), 12384 (2003)

[10] Kasuga T, Hiramatsu M, Hoson A, Sekino T, Niihara K, Langmuir, 14(12), 3160 (1998)

[11] Grimes CA, Journal of Materials Chemistry., 17, 1451 (2007)

[12] Claessens CG, Hahn U, Torres T, Chemical Record., 8, 75 (2008)

[13] Claessens CG, Gonzalez-Rodriguez D, Torres T, Chem. Rev., 102(3), 835 (2002)

[14] Hains AW, Liang ZQ, Woodhouse MA, Gregg BA, Chem. Rev., 110(11), 6689 (2010)

[15] Schumann S, Hatton RA, Jones TS, Journal of Physical Chemistry C., 115, 4916 (2011)

[16] Kang Q, Liu S, Yang L, Cai Q, Grimes CA, Applied Materials & Interfaces., 3, 746 (2011)

[17] Lee BG, Choi JW, Lee SE, Jeong YS, Oh HJ, Chi CS, Transactions of Nonferrous Metals Society of China., 19, 842 (2009)

[18] Yasuda K, Macak JM, Berger S, Ghicov A, Schmuki P, J. Electrochem. Soc., 154(9), C472 (2007)

[19] Bauer S, Kleber S, Schmuki P, Electrochemistry Communications., 8, 1321 (2006)

[20] Ouyang M, Bai R, Yang L, Chen Q, Han Y, Wang M, Yang Y, Chen H, Journal of Physical Chemistry C., 112, 2343 (2008)

[21] Kim SM, Cho KK, Kim KW, Ryu KS, Journal of Korean Powder Metallurgy Institute., 17, 216 (2010)

[22] Macak JM, Hildebrand H, Marten-Jahns U, Schmuki P, Journal of Electroanalytical Chemistry., 621, 254 (2008)

[23] Park NG, van de Lagemaat J, Frank AJ, J. Phys. Chem. B, 104(38), 8989 (2000)

[24] Xi HX, Wei ZM, Duan ZM, Xu W, Zhu DB, Journal of Physical Chemistry C., 112, 19934 (2008)

[25] Karak S, Ray SK, Dhar A, Journal of Physics D: Applied Physics., 43, 245101 (2010)

[26] Macak JM, Tsuchiya J, Ghicov A, Yasuda K, Hahn R, Bauer S, Schmuki P, Current Opinion in Solid State and Materials Science., 11, 3 (2007)

[27] Xu HB, Chen HZ, Xu WJ, Wang M, Chem. Phys. Lett., 412(4-6), 294 (2005)