Electrodeposition of Super Invar thin films and micro-posts are presented. Different pulse plating parameters were applied and the deposit composition distribution along the length of the microstructures was examined. Pulse plating (-60 mA cm (2), 2 s/ 0 mA cm(-2), 27 s) was critical in achieving a uniform composition distribution in 100 micron deep features. Using a pulse scheme with a low, non-zero current step introduced more cracks into the deposit, which were characterized by SEM. The coefficient of thermal expansion (CTE) of the micro-post arrays was also determined and exhibited negative values in the axial direction, i.e., the micro-posts shrink with temperature. Structures with micron size cracks exhibited large, negative CTE values during the first heat cycle of the CTE test and then exhibited less dimensional change with a subsequent heat cycle. (C) 2012 The Electrochemical Society. [DOI: 10.1149/2.002209jes] All rights reserved.