에폭시/아민계의 경화 특성에 미치는 Polyhedral Oligomeric Silsesquioxane의 영향

구푸종; 이종근; Puzhong Gu; Jong Keun Lee

Polymer(Korea), Vol.37, No.1, 41-46, January, 2013

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에폭시/아민계의 경화 특성에 미치는 Polyhedral Oligomeric Silsesquioxane의 영향

Effect of Polyhedral Oligomeric Silsesquioxane on Cure Characterization of an Epoxy/Amine System

구푸종, 이종근 ^†

금오공과대학교 고분자공학과

Puzhong Gu, and Jong Keun Lee^†

Department of Polymer Science and Engineering, Kumoh National Institute of Technology, 1 Yangho-dong, Gumi-City, Gyungbuk 730-701, Korea

E-mail:

초록

유무기 하이브리드 나노 물질인 polyhedral oligomeric silsesquioxane(POSS)를 첨가한 diglycidyl ether of bisphenol A(DGEBA) 에폭시/방향족 아민계를 다양한 경화온도에서 등온으로 반응시킨 후 유리전이온도(Tg)와 전환율(α)을 DSC를 이용하여 측정하였다. 등온 경화시간에 따른 Tg의 변화 데이터를 임의로 설정된 기준 온도에서 수평 이동시켜 반응초기에 해당하는 속도우세 구간에서 서로 겹치게 하여 이때 필요한 이동 인자를 구하였으며, 이를 이용하여 활성화 에너지를 결정하였다. 또한 POSS가 Tg 및 α에 미치는 영향을 조사하였으며 이들의 관계를 알기 위하여 DiBenedetto식을 이용하여 분석하였다.

The glass transition temperature (Tg) and conversion (α) were measured for a diglycidyl ether of bisphenol A (DGEBA) epoxy/aromatic amine system incorporated with an organic-inorganic hybrid molecule, polyhedral oligomeric silsesquioxane (POSS). Samples isothermally cured at varying cure temperatures and times were analyzed by differential scanning calorimetry (DSC). Tg vs. ln (time) data at an arbitrary reference were superposed by time-temperature shifts for the kinetically controlled reaction, and the shift factors were used to calculate an Arrhenius activation energy. Influence of POSS was investigated from Tg vs. α data, which in turn were fitted with DiBenedetto equation.

Keywords:cure behavior;epoxy;amine;polyhedral oligomeric silsesquioxane.

[References]

Lee H, Neville K, Handbook of Epoxy Resins, McGraw-Hill, New York (1982)
May CA, Epoxy Resins Chemistry and Technology, 2nd ed., Marcel Dekker, New York (1988)
Wisanrakkit G, Gillham JK, J. Coat. Technol., 62, 35 (1990)
Lee A, Lichtenhan JD, J. Appl. Polym. Sci., 73(10), 1993 (1999)
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DiBenedetto AT, J. Polym. Sci. Part B: Polym. Phys., 25, 1949 (1987)

[Related Articles]

[1] Lee H, Neville K, Handbook of Epoxy Resins, McGraw-Hill, New York (1982)

[2] May CA, Epoxy Resins Chemistry and Technology, 2nd ed., Marcel Dekker, New York (1988)

[3] Wisanrakkit G, Gillham JK, J. Coat. Technol., 62, 35 (1990)

[4] Lee A, Lichtenhan JD, J. Appl. Polym. Sci., 73(10), 1993 (1999)

[5] Li GZ, Wang LC, Toghiani H, Daulton TL, Koyama K, Pittman CU, Macromolecules, 34(25), 8686 (2001)

[6] Lee A, Lichtenhan JD, Macromolecules, 31(15), 4970 (1998)

[7] Fu BX, Hsiao BS, White H, Rafailovich M, Mather PT, Jeon G, Phillips S, Lichtenhan J, Schwab J, Polym. Int., 49, 437 (2000)

[8] Chen WY, Wang YZ, Kuo SW, Huang CF, Tung PH, Chang FC, Polymer, 45(20), 6897 (2004)

[9] Teo JKH, Teo KC, Pan BH, Xiao Y, Lu XH, Polymer, 48(19), 5671 (2007)

[10] Dodiuk H, Kenig S, Blinsky I, Dotan A, Buchman A, Inter. J. Adhes. Adhes., 25, 211 (2005)

[11] Ramirez C, Rico M, Torres A, Barral L, Lopez J, Montero B, Eur. Polym. J., 44, 3035 (2008)

[12] Choi J, Harcup J, Yee AF, Zhu Q, Laine RM, J. Am. Chem. Soc., 123(46), 11420 (2001)

[13] Zvetkov VL, Polymer, 43(4), 1069 (2002)

[14] Pascault JP, Williams RJJ, J. Polym. Sci. Part B: Polym.Phys., 28, 85 (1990)

[15] DiBenedetto AT, J. Polym. Sci. Part B: Polym. Phys., 25, 1949 (1987)