표면처리실리카를 충전한 에폭시수지계의 물성에 관한 연구: II. 에폭시 수지 경화물의 물성

홍석표; 최상구

Journal of the Korean Industrial and Engineering Chemistry, Vol.1, No.2, 232-239, December, 1990

Export Citation

표면처리실리카를 충전한 에폭시수지계의 물성에 관한 연구: II. 에폭시 수지 경화물의 물성

Physical Properties of Epoxy Resin Filled with Surface-treated Silica:Ⅱ.Properties of Cured Epoxy Resin

홍석표, 최상구

초록

γ-Glycidoxy propyl trimethoxy slilane, CTBN rubber (carboxyl terminated butadiene acrylonitrile rubber), GMA(glycidyl methacrylate) 등을 TEA(triethylamine) 및 BPO(benzoyl peroxide) 존재하에 결정성 실리카의 표면에 단계적으로 반응시켜 2.5∼5.8%(중량%)의 피복율을 가진 표면처리 실리카를 제조하였다. 이것을 전체혼합물 중 0∼60% (중량%) 가 되도록 에폭시 수지 및 MTHPA(methyltetrahydrophthalic anhydride)와 혼합한후 경화시켜 굴곡특성 및 열적특성을 시험하였다. 시험결과, 충전재 함량 35∼55%(중량%)에서, 실란/고무 또는 실란/고무/비닐로 처리된 실리카를 충전한 것은 에폭시 수지에 고무를 직접 3% 혼합하고 여기에 표면 처리하지 않은 실리카를 충전한 것에 비하여 굴곡강도와 Tg는 각각 평균 25%, 13% 높은 값을, 굴곡탄성율은 5% 낮은 값을 나타내었다.

γ-Glycidoxy propyl trimethoxy slilane, CTBN rubber(carboxyl terminated butadiene acrylonitrile rubber) and GMA(glycidyl methacrylate) were reacted with the surface of silica one by one in existence of TEA(triethylamine) or BPO(benzoyl peroxide). The amount of reactant was 2.5∼ 5.8% of treated silica weight. The treated silica was mixed with epoxy resin and MTHPA(methyltetrahydrophthalic anhydride) in the range of 0∼60% (wt. %) of total component. The flexural and thermal properties were tested for cured products. In filler content 35∼55%, the using of silica treated with silane/rubber or silane/rubber/vinyl represented 25% higher flexural strength, 5% lower flexural modulus and 13% higher than mixing liquid rubber 3% with epoxy resin containing untreated silica.

[References]

Jang SB, Polym.(Korea), 4, 115 (1980)
Lee SS, Jung KS, Yeo JK, Polym.(Korea), 11(1), 2 (1987)
Lilley J, Holloway DG, Phil. Mag., 21, 215 (1973)
Nielsen LE, Lewis TB, J. Polym. Sci., 7, 1705 (1969)
Rowe EH, Siebert AR, Drake RS, Mol. Plast., 47, 110 (1970)
Ronald SB, ACS Symp. Ser., 221, 69 (1983)
Gilbert AK, Kantor SW, J. Polym. Sci., 40, 35 (1959)
Lee JG, Lucky Polym. Tech., 5, 60 (1988)
Bascom WD, Cottington RL, Jones RL, Peyster P, J. Appl. Polym. Sci., 19, 2545 (1975)
Zisman WA, Am. Chem. Soc., 1 (1984)
U.C.C., Technical Bulletin (1988)
Zisman WA, Ind. Eng. Chem. Prod. Res. Dev., 8, 98 (1969)
Lee JO, Polym.(Korea), 12(1), 1 (1988)
Zin WC, Polym.(Korea), 12(7), 605 (1988)
Leou JK, Lucky Polym. Tech., 4, 10 (1988)
Yokouchi M, Uchiyama H, Kobayashi Y, J. Appl. Polym. Sci., 25, 1007 (1980)
Frissel WJ, Plast. Tech., 2, 135 (1962)
Krautz FG, J. SPE, 27, 74 (1971)
Siebert AR, Rien CK, Am. Chem. Soc., 16, 552 (1971)
Sayre JA, Rowe EH, Lagasse RR, Polymer, 22, 87 (1981)

[Referenced By]

[1] Jang SB, Polym.(Korea), 4, 115 (1980)

[2] Lee SS, Jung KS, Yeo JK, Polym.(Korea), 11(1), 2 (1987)

[3] Lilley J, Holloway DG, Phil. Mag., 21, 215 (1973)

[4] Nielsen LE, Lewis TB, J. Polym. Sci., 7, 1705 (1969)

[5] Rowe EH, Siebert AR, Drake RS, Mol. Plast., 47, 110 (1970)

[6] Ronald SB, ACS Symp. Ser., 221, 69 (1983)

[7] Gilbert AK, Kantor SW, J. Polym. Sci., 40, 35 (1959)

[8] Lee JG, Lucky Polym. Tech., 5, 60 (1988)

[9] Bascom WD, Cottington RL, Jones RL, Peyster P, J. Appl. Polym. Sci., 19, 2545 (1975)

[10] Zisman WA, Am. Chem. Soc., 1 (1984)

[11] U.C.C., Technical Bulletin (1988)

[12] Zisman WA, Ind. Eng. Chem. Prod. Res. Dev., 8, 98 (1969)

[13] Lee JO, Polym.(Korea), 12(1), 1 (1988)

[14] Zin WC, Polym.(Korea), 12(7), 605 (1988)

[15] Leou JK, Lucky Polym. Tech., 4, 10 (1988)

[16] Yokouchi M, Uchiyama H, Kobayashi Y, J. Appl. Polym. Sci., 25, 1007 (1980)

[17] Frissel WJ, Plast. Tech., 2, 135 (1962)

[18] Krautz FG, J. SPE, 27, 74 (1971)

[19] Siebert AR, Rien CK, Am. Chem. Soc., 16, 552 (1971)

[20] Sayre JA, Rowe EH, Lagasse RR, Polymer, 22, 87 (1981)