This study investigated the liquid state reaction of a Sn-3.0Ag-0.5Cu solder jointed with electroless Ni-P/immersion Au (ENIG) and electroless Ni-P/electroless Pd/immersion Au (ENEPIG) surface finishes. Treatments with various soldering temperatures (240, 250, and 260 degrees C) and times (60, 180, 300, and 600 s) were performed to study the microstructure evolution. Detailed interfacial images revealed that the morphology of (Cu,Ni)(6)Sn-5 affects the formation of Ni3P and the curvature of the interface between them. In addition, the growth kinetics of (Cu,Ni)(6)Sn-5 and (Cu,Ni,Pd)(6)Sn-5 were studied and compared. The effect of grain coarsening during extended reflow modified the diffusion transport mechanism. However, because of the refinement of Pd on the grain structure, reduced IMC growth and a lower degree of transition from grain boundary diffusion to volume diffusion could be observed in the growth kinetics of (Cu,Ni,Pd)(6)Sn-5. Moreover, the activation energy of IMC growth was evaluated using the Arrhenius equation. Pd may act as heterogeneous nucleation sites in the initial stage of soldering and lower the activation energy of (Cu,Ni,Pd)(6)Sn-5, compared to (Cu,Ni)(6)Sn-5. The lower activation energy of (Cu,Ni,Pd)(6)Sn-5 growth ensured that no phase transformation occurred in the SAC305/ENEPIG joints, which may benefit the solder joint reliability. Finally, the detailed influence of Pd on the growth kinetics of IMC formation was investigated and discussed.