후막 구리도체용 유리에 관한 연구

이준; 이상원

Journal of the Korean Industrial and Engineering Chemistry, Vol.2, No.3, 289-299, September, 1991

Export Citation

후막 구리도체용 유리에 관한 연구

A study on the Glass Frit for Thick Film Copper Conductor

이준, 이상원

초록

후막 구리도체에 적합한 유리를 얻기 위하여 연붕규산계 및 무연 붕규산계 유리를 기반으로 하는 9종의 유리를 제조하고 후막 구리도체에의 적합성을 시험하였다. 그 결과 모든 유리들이 후막 구리도체의 쉬트 저항치, 납땜성 및 땜납 침식저항에는 양호하게 기여하는 것을 확인하였다. 그러나 후막과 알루미나 기판간의 노화후의 부착강도는 연붕규산계 유리로 만들어진 구리 도체막 만이 유용한 값을 가졌고, 그 외의 유리로 만들어진 구리 도체막의 노화후 부착강도는 사용하기에 부적합할 정도로 낮은 것이었다. 특히 Cu₂O 가 첨가된 연붕규산계 유리가 후막 구리도체 제조에 가장 양호한 것으로 확인되었다.

In order to obtain glasses appropriate to the thick film copper conductors, nine glasses based on both lead borosilicate and leadless borosilicate systems were made and the applicabilities of them were examined in conjunction with the requirements for thick film copper conductors. As the results, it was found that all the glasses are fitted to provide suitable sheet resistance, solderability and solder leach resistance to thick film copper conductors. However, it was turned out that only the lead borosilicate based glasses worked for getting usable aged adhesion strength of copper thick film to the alumina substrate, while copper conductor films made from the other glasses had poor aged adhesion strengths. Particularly cuprous oxide added lead borosilicate glass was considered as one of the most favorable glasses for manufacturing thick film copper conductors.

[References]

Harmer DW, "Thick Film Hybrid Microcircuit Technology," pp 15-18, Wiley Interscience (1972)
McCandlish CS, Dow AL, Ceram. Bull., 64(4), 547 (1985)
Harper CA, "Handbook of Thick Film Hybrid Microelectronics," pp. 1-3 ~ 1-6 McGraw-Hill (1974)
Needs CRS, "Base Matal Thick Film Materials, A Review of Their Technology and Application," IMC 1982 Proceeding, Tokyo (1982)
Pitkanen DE, Solid State Technol., 23(10), 141 (1980)
Vest RW, Ceram. Bull., 65(4), 632 (1986)
Vest RW, "Adhesion and Densification Studies of Oxide-Free Copper Conductors," ISHM Proc. 873-880, Atlanta (1986)
Need CRS, "Copper Materials System for Microcircuitry," A Status Report, ISHM Proc., 24-26, Tokyo (1982)
Riemer, "The Nitrogen Furnace in Large Volume Thick-Film Production," ISHM Proc., 568-573 (1985)
Siuta VD, U.S. Patent, 4,521,329 (1985)
Bacher RJ, Siuta VD, "Firing Process-related Failure Mechanisms in Thick Film Copper Multilayers," ECC Proc., 471-480, Seattle (1986)
Steinberg J, "Nitrogen Fireable Hybrid Thick Film Inks," ISHM Proc. 392-397, Seattle (1988)
Kuo CY, "Adhesion of Thick Film Copper Conductors," ISHM Proc. 70-78 (1981)
Inokuma T, "Base Matal Actively Used for Conductive Paste for Hybrid ICs," J.E.E. 40-43, April (1986)
이준, "Hybrid 용 Thick Film Copper Conductor의 특성 및 활용에 관한 연구," 한국전자통신연구소 연구보고서 (1986)
이준, "Thick Film Copper Conductor를 이용한 Car Audio용 Noise Canceller의 개발에 관한 연구," 한국전자통신연구소 연구보고서 (1988)
Grier JD, "A Copper Thick Film Metallization Paste," ISHM Proc. (1978)

[1] Harmer DW, "Thick Film Hybrid Microcircuit Technology," pp 15-18, Wiley Interscience (1972)

[2] McCandlish CS, Dow AL, Ceram. Bull., 64(4), 547 (1985)

[3] Harper CA, "Handbook of Thick Film Hybrid Microelectronics," pp. 1-3 ~ 1-6 McGraw-Hill (1974)

[4] Needs CRS, "Base Matal Thick Film Materials, A Review of Their Technology and Application," IMC 1982 Proceeding, Tokyo (1982)

[5] Pitkanen DE, Solid State Technol., 23(10), 141 (1980)

[6] Vest RW, Ceram. Bull., 65(4), 632 (1986)

[7] Vest RW, "Adhesion and Densification Studies of Oxide-Free Copper Conductors," ISHM Proc. 873-880, Atlanta (1986)

[8] Need CRS, "Copper Materials System for Microcircuitry," A Status Report, ISHM Proc., 24-26, Tokyo (1982)

[9] Riemer, "The Nitrogen Furnace in Large Volume Thick-Film Production," ISHM Proc., 568-573 (1985)

[10] Siuta VD, U.S. Patent, 4,521,329 (1985)

[11] Bacher RJ, Siuta VD, "Firing Process-related Failure Mechanisms in Thick Film Copper Multilayers," ECC Proc., 471-480, Seattle (1986)

[12] Steinberg J, "Nitrogen Fireable Hybrid Thick Film Inks," ISHM Proc. 392-397, Seattle (1988)

[13] Kuo CY, "Adhesion of Thick Film Copper Conductors," ISHM Proc. 70-78 (1981)

[14] Inokuma T, "Base Matal Actively Used for Conductive Paste for Hybrid ICs," J.E.E. 40-43, April (1986)

[15] 이준, "Hybrid 용 Thick Film Copper Conductor의 특성 및 활용에 관한 연구," 한국전자통신연구소 연구보고서 (1986)

[16] 이준, "Thick Film Copper Conductor를 이용한 Car Audio용 Noise Canceller의 개발에 관한 연구," 한국전자통신연구소 연구보고서 (1988)

[17] Grier JD, "A Copper Thick Film Metallization Paste," ISHM Proc. (1978)