아라미드 종이의 특성에 대한 표면 개질 과정 조건의 영향

Lizheng Sha; Huifang Zhao

Polymer(Korea), Vol.37, No.2, 196-203, March, 2013

Export Citation

아라미드 종이의 특성에 대한 표면 개질 과정 조건의 영향

Effect of Surface Modification Process Conditions on Properties of Aramid Paper

Lizheng Sha^†, and Huifang Zhao

School of Light Industry, Zhejiang University of Science & Technology, Hangzhou, Zhejiang 310023, China

E-mail:

Surface modification of meta-aramid fibers was performed by phosphoric acid treatment. Surface morphology and element composition of untreated and treated fibers were analyzed by scanning electron microscope (SEM) and Xray photoelectron spectroscopy (XPS). Effects of surface modification on the mechanical strength of aramid papers made from meta-aramid fibers and fibrid were investigated. Surface modification conditions were optimized by response surface analysis (RSA). Results show that phosphoric acid treatment increases the surface roughness and oxygen content of aramid fibers. They improve the interface bonding strength between aramid fibers and fibrid, which improves the tensile strength of aramid papers. The results of response surface analysis indicate that the tensile strength of aramid papers increases by 47.5% and reaches the maximum when meta-aramid fibers are treated with 21.1wt% phosphoric acid solution at 39.3 ℃ for 36.7 min.

Keywords:aramid fiber;phosphoric acid;surface modification;aramid paper;tensile strength.

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[1] George CG, Waynesboro V, U.S.Patent 3,756,908 (1973)

[2] Bhatia A, Proc. of the Electrical/Electronics Insulation Conf., Illinois, USA (1995)

[3] Forsten HH, Khan S, U.S.Patent 6,312,561 (2001)

[4] Nomoto K, U.S.Patent 6,544,622 (2003)

[5] Yang W, Yu H, Zhu MF, J. Macromol. Sci. Phys., 45, 573 (2006)

[6] Jung H, Klein P, Kampschulte U, U.S.Patent 5,432,255 (1995)

[7] Ohba A, Yoshitomi T, Iwasaki H, Takine K, U.S.Patent 6,569,987 (2003)

[8] Merriman EA, TAPPI J., 67, 66 (1984)

[9] Homan B, Kinsley JR, U.S.Patent 2004/0140072A1 (2004)

[10] Park SJ, Seo MK, Polym.(Korea), 29(3), 221 (2005)

[11] Liu TM, Zheng YS, Hu J, J. Appl. Polym. Sci., 118(5), 2541 (2010)

[12] Peng T, Cai RQ, Chen CF, Wang FD, Liu XY, Wang B, Xu JJ, J. Macromol. Sci., Part B: Physics., 51, 538 (2012)

[13] Zhang MY, Yu JH, Lu ZQ, Trans. Chin. Pulp. Pap., 21, 72 (2006)

[14] Yan ZY, Shi HQ, Liu AH, Jia DM, J. Text. Res., 28, 19 (2007)

[15] Sim MK, Seul SD, Polym.(Korea), 32(5), 433 (2008)

[16] SHEU GS, SHYU SS, J. Adhes. Sci. Technol., 8(5), 531 (1994)

[17] Qiu J, Zhang ZQ, Synth. Fiber., 30, 25 (2001)

[18] Zhang YH, Huang YD, He JM, Wu LN, Xu ZW, Compos. Interfaces, 15(6), 611 (2008)

[19] Liu L, Zhang X, Huang YD, Zhang ZQ, J. Aeronautical Mater., 23, 49 (2003)

[20] Liu L, Zhang X, Huang YD, Jiang B, Zhang ZQ, Acta Materiae Compositae Sinica., 20, 35 (2003)

[21] Wang Y, Li P, Yu YH, Sui G, Yang XP, Acta Materiae Compositae Sinica., 24, 7 (2007)

[22] Kim JK, Kim JH, Seoul YG, Polym.(Korea), 18(5), 775 (1994)

[23] Yue CY, Padmanabhan K, Compos. Part B: Engineering., 30, 205 (1999)

[24] Lin JS, Eur. Polym. J., 38, 79 (2002)

[25] Mori M, Uyama Y, Ikada Y, Polymer, 35(24), 5336 (1994)

[26] Nie WZ, Li J, Zhou Z, Polym.-Plast. Technol. Eng., 49, 305 (2010)

[27] Shin SH, Jang JS, Kim EY, Kim HD, Polym.(Korea), 20(1), 134 (1996)

[28] Kim JG, Choi I, Lee DG, Seo IS, Compos. Struct., 93, 2696 (2011)

[29] Tappi Standard, T494 om-01. Tensile Properties of Paper and Paperboard (Using Constant Rate of Elongation Apparatus), USA (2001)

[30] Zhao HF, Zhang MY, Zhang SF, Lu JB, Polym. -Plast. Technol. Eng., 51, 134 (2012)

[31] Lin TK, Wu SJ, Lai JG, Shyu SS, Compos. Sci. Technol., 60, 1873 (2000)

[32] Ramazan B, Tesoro CG, Tex. Res. J., 60, 334 (1990)