Interfaces of dissimilar materials in electronic packaging are prone to crack initiations leading to delaminations. The aim of this paper is to perform a mechanical characteristics comparison approach of the interface structures of different metals with metal Cr. The W/Cr interface, Al/Cr interface, and Cu/Cr interface prototypes were deposited on the quartz glass by using RF magnetron sputtering. The Elastic Modulus and the hardness of the interface prototype were tested by using nano indenter, respectively. The test results show that the elastic modulus and the hardness of these interface prototypes are different at the difference maximum depth . The elastic modulus and the hardness of each interface show a marked nonlinearity although there is the same metal Cr in these interfaces samples. Such comparison approach is an important measure to find an appropriate nonlinearity for electronic packaging. The investigation implies that there is a potential probability for improving the mechanical properties in the metal-matching interface for some application.