Urea-formaldehyde (UF) resin is one of the most commonly used wood adhesives for making particleboards. However, UF emits carcinogenic formaldehyde and is derived from nonrenewable petrochemicals. In this study, a new formaldehyde-free wood adhesive that is based on soy flour and a renewable material-based curing agent (CA) were prepared and evaluated for the preparation of M-2 grade particleboards. The new CA was derived from ammonia and epichlorohydrin that can be derived from renewable glycerol. The composition of the adhesive was soy flour/sodium hydroxide/CA at a dry weight ratio of 9/0.3/1.0. The modulus of rupture, modulus of elasticity, and internal bond strength met the minimum industrial requirements of M-2 particleboards using the following variables: hot-press temperature of 190 degrees C, hot-press time of 240s, the adhesive usage of the face particles of 12wt.%, the adhesive usage of the core particles of 10wt.%, and the target particleboard density of 0.80g/cm(3).