Poly-silicon based superhydrophobic surface (water contact angle > 150A degrees) is being fabricated and its electrowetting properties have been studied. The polysilicon thin film has been deposited over patterned gold electrodes. The polysilicon film is structured to form nanoscale features using Reactive Ion Etching. A thin film of HfO2 high k-dielectric is deposited over the structured polysilicon surface. The surface was chemically modified with Trichloro (1H, 1H, 2H, 2H-perfluorooctyl) silane (PFOS). Such a surface showed Superhydrophobic behavior with water contact angle of 172A degrees and roll off angle < 3A degrees. The electrowetting properties of the fabricated device was studied by applying a DC voltage between the gold electrode and the droplet. The electrowetting commences when the applied voltage was 18 V and the contact angle is reduced to 152A degrees. As the applied voltage was increased there was decrease in contact angles.