The adhesion of Au films grown by electrodeposition or sputtering onto smooth or porous Si substrates is compared. Electroplated Au films on porous Si present the largest specific energy, i.e. the largest energy required to remove the unit film volume, the lowest friction coefficient and minimum material removal, occurring mainly by cutting. Sputtered Au films and Au/Cr bilayers resist adhesive failure when deposited onto porous Si, and exhibit material removal via a plowing mechanism. Au films sputtered on smooth Si exhibit adhesive failure and extensive material removal by delamination. Electroplating onto porous materials appears to be a practical and advantageous method to strongly enhance film adhesion to technologically relevant substrates. (C) 2013 The Electrdchemical Society. All rights reserved.