실리콘 변성 에폭시 코팅 액의 제조와 물성

김진경; 박승우; 황희남; 강두환; 강호종; Jin Kyung Kim; Seung Woo Bak; Hee Nam Hwang; Doo Whan Kang; Ho Jong Kang

Applied Chemistry for Engineering, Vol.25, No.4, 352-356, August, 2014

Export Citation

실리콘 변성 에폭시 코팅 액의 제조와 물성

Preparation and Properties of Silicone-Modified Epoxy Coating Materials

김진경, 박승우, 황희남¹, 강두환 , 강호종 ^†

단국대학교 고분자시스템공학과
¹(주)아이컴포넌트

Jin Kyung Kim, Seung Woo Bak, Hee Nam Hwang¹, Doo Whan Kang , and Ho Jong Kang^†

Department of Polymer Science and Engineering, Dankook University, Gyeonggi-do 448-701, Korea
¹I-Component Corp., Gyeonggi-do 451-805, Korea

E-mail:

초록

α,ω-Aminopropylpolydimethylsiloxane을 bisphenol-A diglycidyl ether (DGEBA)계 이관능성 에폭시 수지와 반응시켜 polydimethylsiloxane(PDMS)의 양 말단에 에폭시가 도입된 실리콘 변성 에폭시 수지(EMPDMS)를 제조한 다음 alkylesteraminopropyl alkoxy silane (XD 5607)을 반응시켜 PDMS가 도입된 에폭시 hybrid 화합물(EMPDMSH)을 제조하고 이를 FT-IR, 1H-NMR 및 29Si-NMR로 구조를 확인하였다. EMPDMSH base 수지에 용매를 혼합하여 코팅 액을 제조하였으며, 이를 에폭시/유리 섬유 복합재료로 얻어진 필름에 도포하고 경화시킨 후 base수지 중에 함유된 PDMS의 함량에 따른 물성을 측정하였다. 코팅 면의 접촉각을 측정한 결과 기존의 에폭시 수지로 코팅하여 얻은 코팅 면에 비해 접촉각이 41° 에서 71°로 약 30° 정도 증가되고 있어 코팅 면에 PDMS가 나타나 있음을 확인할 수 있었다. 또한 접착력 및 표면 평활도 개선효과 측정 결과 에폭시 자체 코팅 액이나 일반적으로 많이 사용되고 있는 아크릴계 코팅 액 보다 5B 등급의 뛰어난 접착력을 나타내었고 평활도 개선 효과도 우수함을 나타내었다.

PDMS modified epoxy resin with epoxy group (EMPDMS) was prepared from the reaction of α,ω-aminopropylpolydimethylsiloxane and diglycidyl ether of bisphenol-A (DGEBA) based epoxy resin, and PDMS modified epoxy hybrid compound (EMPDMSH) was prepared by introducing alkylesteraminopropyl alkoxy silane to EMPDMS. Their structures were characterized using FT-IR, 1H-NMR and 29Si-NMR. Coating materials were prepared by mixing EMPDMSH base and solvent. Physical properties of the coating materials coated on epoxy/glass fiber composite film were measured according to the content of PDMS in EMPDMSH. Contact angle of coating film was increased 30 to 71 degree. Adhesive property of coating film was 5B degree better then epoxy or acrylate coating materials, and surface roughness was decreased as increasing in EMPDMSH.

Keywords:aminopropylpolydimethylsiloxane;silicone modified epoxy;contact angle;roughness

[References]

Mark HF, Bikles NM, Overberger CG, Menges G, Kroschwitz JI, Encyclopedia of Polymer Science and Engineering 2nd, 6, 225-382 (1986)
Lewis AF, Epoxyresins, chemistry and technology, 1, 653 (1988)
Domininghaus H, Plastics for Engineers, 1, 659 (1993)
Hong HS, Information Analysis, KISTI, 1, 1 (2006)
Velan TVT, Bilal IM, Bull. Mater. Sci., 23, 425 (2000)
Baek JH, Lee JH, Lee MK, Seo CS, Kwak ST, Moon MJ, J. Korea. Imag. Tech., 12, 53 (2006)
Soundararajan S, Reddy BSR, Applide Polymer, 43, 251 (1991)
Lakshmi MS, Reddy BSR, J. Malays. Polym., 5, 84 (2010)
Ochi M, Shimaoka S, Polymer, 40(5), 1305 (1999)
Yano H, Sugiyama J, Nakagaito AN, Nogi M, Matsuura T, Hikita M, Handa K, Adv. Mater., 17(2), 153 (2005)
Kim JY, Han SI, Kim DK, Kim SH, Composite, Part A, 40, 45 (2009)
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Kim JH, Kim HS, Kang HJ, Polymer(Korea), 36, 6 (2012)
Ito H, Oka W, Goto H, Umeda H, Jpn. J. Appl Phys., 45, 4321 (2006)

[Related Articles]

[1] Mark HF, Bikles NM, Overberger CG, Menges G, Kroschwitz JI, Encyclopedia of Polymer Science and Engineering 2nd, 6, 225-382 (1986)

[2] Lewis AF, Epoxyresins, chemistry and technology, 1, 653 (1988)

[3] Domininghaus H, Plastics for Engineers, 1, 659 (1993)

[4] Hong HS, Information Analysis, KISTI, 1, 1 (2006)

[5] Velan TVT, Bilal IM, Bull. Mater. Sci., 23, 425 (2000)

[6] Baek JH, Lee JH, Lee MK, Seo CS, Kwak ST, Moon MJ, J. Korea. Imag. Tech., 12, 53 (2006)

[7] Soundararajan S, Reddy BSR, Applide Polymer, 43, 251 (1991)

[8] Lakshmi MS, Reddy BSR, J. Malays. Polym., 5, 84 (2010)

[9] Ochi M, Shimaoka S, Polymer, 40(5), 1305 (1999)

[10] Yano H, Sugiyama J, Nakagaito AN, Nogi M, Matsuura T, Hikita M, Handa K, Adv. Mater., 17(2), 153 (2005)

[11] Kim JY, Han SI, Kim DK, Kim SH, Composite, Part A, 40, 45 (2009)

[12] Kim W, Kim YY, Son JS, Yun DS, Han C, Choi JK, Jo BW, Elastomer, 37(4), 244 (2002)

[13] Kim JH, Kim HS, Kang HJ, Polymer(Korea), 36, 6 (2012)

[14] Ito H, Oka W, Goto H, Umeda H, Jpn. J. Appl Phys., 45, 4321 (2006)