Chemical looping with oxygen uncoupling (CLOU) is a promising CO2-capture ready energy technology that employs oxygen carriers with thermodynamic properties that cause oxygen to be spontaneously liberated as gaseous O-2 in the fuel reactor, where it can react directly with solid fuels. One of the promising CLOU carrier materials is copper oxide, cycling between CuO and Cu2O. Experimentally determined rate expressions for these reactions are needed for proper development, modeling, and scale-up of CLOU technology. The evaluation of rates for this system is not straightforward, however, since the equilibrium partial pressure of oxygen is appreciable and varies significantly in the temperature range of interest. This in turn affects the driving force for oxidation, and also affects rates of reduction. The study presented here aims to better understand the oxidation conversion characteristics, to decouple the influence of temperature and driving force for a range of carrier materials, and to offer suitable rate expressions. It is concluded that the well-documented decrease in oxidation rate at higher temperatures cannot be explained solely by the decrease in driving force, but that physical development of copper boundaries likely plays a more significant role at high temperatures.