Room temperature tensile testing was performed on a coarse-grained polycrystalline Ni (32 mu m), a nanocrystalline Ni (23 nm) and two nanocrystalline Ni-Fe (16 nm) electrodeposits at two strain rates of 10(-1) and 10(-2)/s. Strain localizations and local temperature increases were simultaneously recorded during tensile testing. For all materials, higher loads or higher strain rate generally resulted in higher peak temperature with the highest temperatures recorded in the fracture regions. The maximum temperature for the nanocrystalline materials was just over 80 A degrees C, which is significantly below the reported temperatures for the onset of thermally activated grain growth. Therefore, the previously reported grain growth observed on similar materials after tensile deformation is likely not thermally activated but a stress-induced phenomenon. Despite the wide grain range from 16 nm to 32 mu m, all samples exhibited similar strain localization behavior. Local strain variations initiated in the early stage of macroscopic uniform deformation, subsequent necking and fracture took place in the region of initial strain localization. While the coarse-grained polycrystalline Ni exhibited little strain rate sensitivity, gradually increased strain rate sensitivity was observed for the 23 nm Ni and the two 16 nm Ni-Fe samples, suggesting that both dislocation-mediated and grain-boundary-controlled mechanisms were operative in the deformation of the nanocrystalline Ni and Ni-Fe samples.