Cure Behavior of Diglycidyl Ether of Bisphenol A/ Diaminodiphenylmethane in the Presence of α,ω-Methyl Carboxylate-Butadiene-Acrylonitrile Copolymer

Ko MB; Kim SC; Jo WH

Korea Polymer Journal, Vol.2, No.2, 131-139, October, 1994

Ko MB, Kim SC, Jo WH

The isothermal cure behavior of diglycidyl ether of bisphenol A (DGEBA)/diaminodiphenyl methane (DDM) in the presence of α,ω-methyl carboxylate-butadiene-acrylonitrile copolymer (est-CTBN) has been analyzed by differential scanning calorimetry and rheometry. the result shows that the cure mechanism changes from the autocatalytic cure mechanism to the nth order reaction as the concentration of est-CTBN increases. This change of mechanism seems to be caused by the decrease in the degree of participation of the hydroxyl group in situ formed as a result of the reaction between an epoxide group and a primary amine of DDM during the subsequent ring opening. the lower participation of the hydroxyl group in the ring opening may arise from the fact that the probability to form hydrogen bonds between the hydroxyl groups and carbonyl groups of est-CTBN becomes greater as the concentration of est-CTBN increases.

[References]

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[2] Riew CK, Gillham JK, Rubber-Modified Thermoset Resins, American Chemical Society, Washington, D.C. (1984)

[3] Vazquez A, Rojas AJ, Addabo HE, Borrajo J, Williams RJJ, Polymer, 28, 1156 (1987)

[4] Ko MB, Kim SC, Jo WH, manuscript in preparation

[5] Banks P, Peters RH, J. Polym. Sci. A: Polym. Chem., 8, 2595 (1970)

[6] Rogers MG, J. Appl. Polym. Sci., 16, 1953 (1972)

[7] Williard PE, Polym. Eng. Sci., 12, 120 (1972)

[8] Jenkins R, Karre L, J. Appl. Polym. Sci., 10, 303 (1966)

[9] Batzer H, Zahir SA, J. Appl. Polym. Sci., 19, 601 (1975)

[10] Koenig JL, Kshih PT, J. Polym. Sci. A: Polym. Chem., 10, 721 (1972)

[11] Matsumoto A, Oiwa M, J. Polym. Sci. A: Polym. Chem., 8, 751 (1970)

[12] Fisch W, Hoffman W, Schmid R, J. Appl. Polym. Sci., 13, 295 (1969)

[13] Miller B, J. Appl. Polym. Sci., 10, 217 (1966)

[14] Moehlenpah AE, Dibenedetto AT, Isahi O, Polym. Eng. Sci., 10, 170 (1970)

[15] Williard PE, Polym. Eng. Sci., 14, 273 (1974)

[16] Babayevsky PG, Gillham JK, J. Appl. Polym. Sci., 17, 2067 (1973)

[17] Acitelli MA, Prime RB, Sacher E, Polymer, 12, 335 (1971)

[18] Prime RB, Sacher E, Polymer, 13, 455 (1972)

[19] Prime RB, Polym. Eng. Sci., 13, 365 (1973)

[20] Sourour S, Kamal MR, Thermochim. Acta, 14, 41 (1976)

[21] Mijovic J, Kim JW, Slaby J, J. Appl. Polym. Sci., 29, 1449 (1984)

[22] Mijovic J, Wang HT, J. Appl. Polym. Sci., 37, 2661 (1989)

[23] Moroni A, Mijovic J, Pearce EM, J. Appl. Polym. Sci., 32, 3761 (1986)

[24] Mijovic J, J. Appl. Polym. Sci., 31, 1177 (1986)

[25] Prime RB, Thermal Characterization of Polymeric Materials, Ch. 5, E.A. Turi, Ed., Academic Press, New York (1982)

[26] Horie K, Hiura H, Sawada M, Mita I, Kambe H, J. Polym. Sci. A: Polym. Chem., 8, 1357 (1970)

[27] Ryan ME, Dutta A, Polymer, 20, 203 (1979)

[28] Hwang JG, Row CG, Hwang I, Lee SJ, HWAHAK KONGHAK, 30(6), 664 (1992)

[29] Klute CH, Viehmann W, J. Appl. Polym. Sci., 5, 86 (1961)

[30] Riccardi CC, Addabo HE, Williams RJJ, J. Appl. Polym. Sci., 29, 2481 (1984)

[31] Yang YS, Suspene L, Polym. Eng. Sci., 31, 321 (1991)

[32] Yang YS, Lee LJ, Polymer, 29, 1793 (1988)

[33] Verchere D, Sautereau H, Pascault JP, Moschiar SM, Riccardi CC, Williams RJJ, J. Appl. Polym. Sci., 41, 467 (1990)

[34] Verchere D, Sautereau H, Pasccault JP, Riccardi CC, Moschiar SM, Williams RJJ, Macromolecules, 23, 725 (1990)