화학공학소재연구정보센터
Materials Science Forum, Vol.389-3, 1281-1284, 2002
Microstructural characterization of recombination-induced stacking faults in high-voltage SiC diodes
Microstructure of stacking faults formed in the high voltage 4H- and 6H-SiC p-n(-) diodes under forward bias has been investigated using conventional and high-resolution transmission electron microscopy (TEM). All the observed stacking faults were isolated single-layer Shockley type bound by partial dislocations with Burgers vector of a/3<1-100>.