Cu/SiC functionally graded materials (FGMs) were prepared using coated Cu/SiC composite powder and spark plasma sintering (SPS). Characterization was carried out with XRD, EDS, TEM, and optical microscope. It was found that a graded structure was formed in the sintered cylindrical compacts. The Cu content was higher near the cylindrical surface and dropped gradually within the bulk. The hardness increased versus the distance from the cylindrical surface. Such a structure was beneficial to the low surface electrical contact resistance and good surface thermal-releasing properties.