Critical steps for the fabrication of SiC devices are thermal annealing and metal ohmic contact formation. Metal annealing effect on the electrical characteristics of the current limiter underlines the necessity to control this device fabrication step. Measurements of contact resistivity as a function of temperature demonstrate the stability of the N type Ni/SiC contact in the range of 175 K - 450 K as its value remains constant around 40 muOmega.cm(2). Post implantation annealing effect on the sheet resistance (R-sh) shows that a 1700degreesC/30 min annealing gives better trade off in terms of dopant activation and surface roughness. High power density has been measured up to 600 V. Current thermal stability has been measured for an applied drain to source voltage of 100 V and exhibits high power density capabilities of SiC VJFET as a controlled current limiter.