The orientation evolution in Copper single crystal during ECAE (in Route C) has been investigated experimentally for 90 degrees die angle by X-ray diffraction and TEM-OIM. It is shown that after the previous three passes of ECAE, orientation evolutes with similar mechanism to the simple shear deformation. The grain subdivision occurs with the appearance of many low angle grain boundaries. After four times extrusions the ED of the samples remains stable, their ND rotates around the ED by about 20 degrees. After five times extrusions the main texture component remains stable.