Deformation and recrystallization texture has been investigated in Oxygen free high conducting (OFHC) copper wires drawn at room temperature to true strain of 2.31, and isothermally annealed at various temperatures between 150 degrees C and 750 degrees C. Local orientations of the microstructures were measured by means of electron backscattered diffraction (EBSD) technique. While the drawn wire was characterized by a major < 111 > + minor < 100 > duplex fiber texture; recrystallization occurred at annealing temperatures between 250 degrees C and 400 degrees C and resulted into a major < 100 >+minor < 111 > recrystallization texture. At temperatures above 500 degrees C, the < 100 > dominated recrystallization texture changed to the < 111 > dominated growth texture due to secondary recrystallization, which favored the < 111 > orientation at the expense of the < 100 > component.