This work presents the results of a study on textural and microstructural inhomogeneities that develop during annealing of heavily drawn Oxygen free high conducting (OFHC) copper wire. The wire was drawn at room temperature to a true strain of 2.31 and isothermally annealed at 750 degrees C for annealing times ranging from 10s to 1hr. The inhomogeneity of microstructure across the wire was clearly visible as three distinct concentric regions, which were classified as: the inner core, the mid section, and the outer surface. Two texture transitions were observed. At shorter annealing time, recrystallization which originated from the mid section, resulted into a strong < 100 >+weak < 111 > duplex fiber texture. However, prolonged annealing gave rise to abnormal grain-growth that proceed from the mid section to the outer surfaces with a dominant < 111 > fiber component at the mid and inner region, and mixed components of < 111 >, < 100 >, and < 112 > at the outer surfaces.