Grains near surface were refined by sliding wear in copper under several contact load conditions. The produced microstructures changing along depth direction were investigated with a help of the electron channeling contrast (ECC) technique. The microstructures formed below the worn surface were divided into Three regions which were stacked in order of the equiaxed grains structures, the layered structures, and the dislocation cells. The minimum grain size adjacent to the worn surface was reduced down to 300nm.