In this paper, the machining possibilities of silicon wafers by the EDM process are described. Micro components of silicon wafer were processed by EDM process. A fine tungsten carbide rod was machined as tool electrode for EDM process. Performance was investigated utilizing serious experiments. Micro hole was process with the fine electrode using EDM drilling. Micro slots were also processed on the surface of a silicon plate by a copper section electrode. The surface roughness of the silicon wafers in the EDM process was investigated. Array-micro-hole was machined by a tungsten carbide multi-electrode. Array micro holes on the coaxial circle were processed by a graphite-copper electrode of Dia.0.45mm. Batch production technology for economical EDM machining of micro holes were proposed.