In this work, we made micromolds using SU-8 photoresist and adopted electroless Ni-P deposition, well known as a hard coating material, to improve the rigidity and durability of SU-8 micromolds. After a micromold using SU-8 was defined by conventional lithography, Ni-P layer was electrolessly deposited on SU-8. By means of electroless Ni-P deposition, it was possible to increase the hardness of a micromold as much as about 17 times. In addition, it will be able to make various sized micromolds with one photomask by regulating the thickness of Ni-P layer.