Materials Science Forum, Vol.522-523, 27-36, 2006
High temperature passive oxidation mechanism of CVD SiC
The passive oxidation mechanism of CVD SiC was discussed from experimental results with high-temperature thermogravimetry and thermodynamic analyses. The bubble formation temperature around 1900 K could be too low for an oxygen inward diffusion limited process but conform to a CO outward diffusion limited process. The parabolic rate constant (kp) had weak oxygen partial pressure (P(O2)) dependence, kp proportional to P(O2)(n) where n = 0.09 to 0.12. These n values may be consistent with the CO outward diffusion limited process. The activation energy of kp obtained in the present study, 210 kJ/mol, could suggest a different mechanism from the well-approved oxygen molecule permeation limited process at lower temperatures below 1600 K. Amorphous phase was significantly contained in SiO(2) scales formed in an N(2)-O(2) atmosphere. No effect of the amorphous formation on kp was identified.
Keywords:passive oxidation;CVD;chemical vapor deposition;SiC;linear parabolic;parabolic rate constant;bubble formation;rate limiting process;CO outward diffusion