Plasma Chemistry and Plasma Processing, Vol.34, No.4, 933-947, 2014
Effect of Plasma Deposition Using Low-Power/Non-thermal Atmospheric Pressure Plasma on Promoting Adhesion of Composite Resin to Enamel
This study investigated the effect of monomer deposition through a low-power, non-thermal atmospheric pressure plasma (NT-APP) on adhesion of resin composite to enamel and its durability. The adhesion of resin composite to enamel and its durability were compared using micro-shear bond strength (MSBS) tests, with or without monomer deposition and before or after thermocycling (TC). The bond strength data were interpreted using Weibull analysis. Hydrophilicities of treated ceramic surfaces were compared with contact angle measurements. Surface characterization was performed with a Fourier transform infra-red spectrophotometer and X-ray photoelectron spectroscopy. The fracture mode at the interface was evaluated using a stereomicroscope and a scanning electron microscope. The plasma polymer deposition of benzene and 1,3-butadiene using the low-power NT-APP improved the MSBS of resin composite to enamel (p < 0.05). Surface characterization suggested improved wettability and changes in the chemical composition of the plasma-deposited enamel surface. However, the mean values of the MSBS of the plasma polymer-deposited groups decreased after TC (p < 0.05). After TC, the Weibull modulus (m) values increased in all the groups, especially in the plasma polymer-deposited groups. Plasma polymer deposition improved enamel adhesion but failed to improve durability in terms of mean bond strength. However, the plasma polymer deposition increased the Weibull modulus m after TC, which indicated that the scatter of the bond strength was narrowed with respect to durability.
Keywords:Enamel;Low-power non-thermal atmospheric pressure plasma;Micro-shear bond strength;Thermocycling;Weibull modulus