Conventional deep level transient spectroscopy (DLTS) technique was used to study deep electron traps in 4H-SiC Junction Barrier Schottky (JBS) rectifiers. 4H-SiC epitaxial layers, doped with nitrogen and grown on standard n(+)-4H-SiC substrates were exposed to low-dose aluminum ion implantation process under the Schottky contact in order to form both JBS grid and junction termination extension (JTE), and assure good rectifying properties of the diodes. Several deep electron traps were revealed and attributed to impurities or intrinsic defects in 4H-SiC epitaxial layers, on the basis of comparison of their electrical parameters (i.e. activation energies, apparent capture cross sections and concentrations) with previously published results. (C) 2014 Elsevier Ltd. All rights reserved.