Thermochimica Acta, Vol.590, 66-72, 2014
Effect of neutral nickel catalyst on cure process of silicon-containing polyarylacetylene
The curing behavior of silicon-containing polyarylacetylene (PSA) with nickel acetylacetonate and triphenylphosphine (Ni(acac)(2)/PPh3) as a catalyst was studied by differential scanning calorimetry (DSC), FTIR in situ monitoring and gel time analysis. The thermal stability of the cured PSA was performed on thermogravimeter. The results show that the catalytic effect of Ni(acac)(2)/PPh3 on curing reaction of PSA is distinct. The peak temperature of cure reaction of PSA was decreased by 100 degrees C when the catalyst was added into the resin at a molar ratio of 100:1. The conversion ratio of the terminal alkynes in PSA cured with the catalyst is higher than that cured without catalyst during heating. The internal alkynes in PSA are apt to achieve when the catalyst is added in the early stage of curing process. The apparent activation energy of the gel process of PSA with the catalyst declined about 30%. The catalyst-added PSA was cured at lower temperature. The temperature at 5% mass loss and residual yield at 800 degrees C in N-2 of the cured PSA with the catalyst-added and catalyst-free are 615 degrees C and 89%, 618 degrees C and 90%, respectively. (C) 2014 Elsevier B.V. All rights reserved.
Keywords:Silicon-containing polyarylacetylene resin;Nickel acetylacetonate;Triphenylphosphine;Catalytic curing;Thermal stability