화학공학소재연구정보센터
Thin Solid Films, Vol.548, 313-316, 2013
Fabrication of superhydrophobic copper surface by direct current sputtering and its underwater stability
Superhydrophobic copper films with hierarchically sandbeach-like morphologies were grown on Si substrates using direct current (DC) sputtering. After the surfaces were hydrophobized with 1-Octadecanethiol (ODT), the surfaces became superhydrophobic. The substrate temperature during sputtering played a key role in the formation of the surface morphology. The films exhibited long-term stability in the temperature range of 25 to 100 degrees C. The underwater stability of the surfaces was also characterized by studying the water contact behavior on the immersed surfaces under different static pressures. After immersion in different depth in water, the film surfaces changed from superhydrophobic even to superhydrophilic, due to the water trapped in the surface structures. A model was proposed to explain such change in the surface wettability. (C) 2013 Elsevier B. V. All rights reserved.