In electrowetting, a droplet/substrate contact angle is modulated by applying a potential difference between the droplet and the substrate. Typically, the droplet potential is changed via an auxiliary electrode dipped in the droplet. Here, it is shown that electrochemical reactions lead to a potential drop on the auxiliary electrode in electrowetting, which degrades the droplet contact angle modulation. The magnitude of this effect depends on the voltage polarity. This problem can be addressed by using a dielectric layer, such as SiO2, which can prevent electrochemical reactions with the electrowetting substrate and the auxiliary electrode. (C) 2013 Elsevier B.V. All rights reserved.