A simple technique for the transfer of thin gold layer from poly(methyl methacrylate) (PMMA) stamp onto SU-8 photoresist is described and verified. The procedure comprises sputtering of thin gold layer on flat or laser patterned PMMA, bringing the PMMA stamp into contact with photoresist substrate, transferring of the gold layer onto photoresist and finally dissolution of the PMMA stamp. Surface morphology of as sputtered and transferred gold layers was determined by profilometry, confocal microscopy, and atomic force microscopy (AFM) techniques at three different scales. Electrical properties were examined by conductive AFM technique. The transfer from patterned PMMA stamp leads to simultaneous patterning of the gold layer and creation of a system of ordered conductive gold strips separated by non-conductive areas on photoresist surface. (C) 2013 Elsevier B. V. All rights reserved.