The film stresses in two-phase (TiNi)/(W) shape memory alloy (SMA) multilayer thin films were evaluated using synchrotron diffraction analysis. The phase transforming B2-TiNi phase is under tensile stress due to the mismatch of the coefficient-of-thermal-expansion (alpha(B2-TiNi) > alpha(W)> alpha(Si-substrate)) and the elastic modulus (E-W > E-Si > EB2-TiNi) with respect to the bcc-W layers and the Si-substrate. The amount of stress on the B2-TiNi phase increases with increasing W amount in the film, which is proportional to the W layer thickness. This led to important changes in the behavior of the B2-R transformation. On cooling, a B2-R transformation proceeds under increasing tensile stress which increases the transformation start temperature (R-s). Upon transformation to the R phase, the TiNi layers undergo stress-relaxation by reorientation of R phase variants to accommodate the mismatch. During heating the film always starts from a relaxed stress-state, so the reverse transformation proceeds without adversely affecting the reverse transformation temperature (A(f)). With increasing amount of W in the film R-s increases more on cooling, while A(f) is not significantly affected on heating, and this leads to vanishing thermal hysteresis (Delta TB2-R = A(f) - R-s). (C) 2014 Elsevier B.V. All rights reserved.