PCB의 ENIG와 OSP 표면처리에 따른 Sn-3.5Ag 무연솔더 접합부의 Electromigration 특성 및 전단강도 평가

김성혁; 이병록; 김재명; 유세훈; 박영배; Sung-Hyuk Kim; Byeong-Rok Lee; Jae-Myeong Kim; Sehoon Yoo; Young-Bae Park

Korean Journal of Materials Research, Vol.24, No.3, 166-174, March, 2014

DOI10.3740/MRSK.2014.24.3.166 Export Citation

PCB의 ENIG와 OSP 표면처리에 따른 Sn-3.5Ag 무연솔더 접합부의 Electromigration 특성 및 전단강도 평가

Effects of PCB ENIG and OSP Surface Finishes on the Electromigration Reliability and Shear Strength of Sn-3.5Ag PB-Free Solder Bump

김성혁, 이병록¹, 김재명², 유세훈³, 박영배^{1, †}

네패스 반도체연구소
¹안동대학교 신소재공학부 청정에너지 소재기술 연구센터
²스태츠칩팩코리아 기술연구소
³한국생산기술연구원 용접접합기술센터

Sung-Hyuk Kim, Byeong-Rok Lee¹, Jae-Myeong Kim², Sehoon Yoo³, and Young-Bae Park^{1, †}

Nepes Corporation, Ochang 363-880, Korea
¹School of Materials Science and Engineering, Andong National University, Andong 760-749, Korea
²STATS ChipPAC Korea Ltd, Icheon 467-701, Korea
³Korea Institute of Industrial Technology, Micro-Joining Center, Incheon 406-840, Korea

E-mail:

The effects of printed circuit board electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) surface finishes on the electromigration reliability and shear strength of Sn-3.5Ag Pb-free solder bump were systematically investigated. In-situ annealing tests were performed in a scanning electron microscope chamber at 130, 150, and 170 oC in order to investigate the growth kinetics of intermetallic compound (IMC). Electromigration lifetime and failure modes were investigated at 150 oC and 1.5 × 105 A/cm2, while ball shear tests and failure mode analysis were conducted under the highspeed conditions from 10 mm/s to 3000 mm/s. The activation energy of ENIG and OSP surface finishes during annealing were evaluated as 0.84 eV and 0.94 eV, respectively. The solder bumps with ENIG surface finish showed longer electromigration lifetime than OSP surface finish. Shear strengths between ENIG and OSP were similar, and the shear energies decreased with increasing shear speed. Failure analysis showed that electrical and mechanical reliabilities were very closely related to the interfacial IMC stabilities.

Keywords:Sn-3.5Ag Pb-free solder;electroless nickel immersion gold(ENIG);organic solderability preservative(OSP);highspeed shear test;electromigration

[References]

Directive 2002/95/EC on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment(RoHS), The European Parliament and of the Council of the European Union, Jan. (2003)
European Union WEEE Directive, 3rd Draft, May. (2000)
Suh D, Kim DW, Liu P, Kim H, Weninger JA, Kumar CM, Prasad A, Grimsley BW, Tejada HB, Mater. Sci. Eng. A, 460, 595 (2007)
Kim DG, Kim JW, Ha SS, Noh BI, Koo JM, Park DW, Ko MW, Jung SB, J. Alloys Compd., 458, 253 (2008)
Carson F, Lee SM, Vijayaragavan N, IEEE Compt, Packag. Manuf. Technol. (CPMT), 737 (2007)
Koo JM, Lee CY, Jung SB, J. Microelectron. Packag. Soc., 14(4), 71 (2007)
Chang D, Bai F, Wang YP, Hsiao CS, Proc. 6th Electron. Packag. Technol. Conf. (EPTC), IEEE, 149 (2004)
Lee HK, Son SH, Lee HY, Jeon JM, J. Kor. Inst. Surf. Eng., 40(1), 32 (2007)
Ding M, Wang G, Chao B, Ho PS, Su P, Uehling T, J. Appl. Phys., 99, 094906 (2006)
Kim JM, Jeong MH, Yoo SH, Park YB, J. Electron. Mater., 41, 4 (2012)
Kim JM, Jeong MH, Yoo SH, Lee CW, Park YB, Microelectronic Engineering, 89, 55 (2012)
Kim SH, Kim JM, Yoo SH, Park YB, Curr. Appl. Phys., 13, S103 (2013)
Kim SH, Kim JM, Yoo SH, Park YB, J. Microelectro. Packag. Soc., 19, 4 (2012)
Leel JH, Park YB, J. Electron. Mater., 38, 10 (2009)
JESD22-B117A (Solder Ball Shear), JEDEC Standard, Jul. (2006)
Lim GT, Kim BJ, Lee KW, Kim JD, Joo YC, Park YB, J. Electron. Mater., 38, 2228 (2009)
Lu YD, He XQ, En YF, Wang X, Zhung ZQ, Acta Mater., 57, 2560 (2009)
Lin YH, Hu YC, Tsai CM, Kao CR, Tu KN, Acta Mater., 53, 2029 (2005)
Lin YH, Tsai CM, Hu YC, Lin YL, Kao CR, J. Electron. Mater, 34, 27 (2005)
Lee JH, Lim GT, Yang ST, Suh MS, Chung QH, Byun KY, Park YB, J. Kor. Phys. Soc., 54, 1784 (2009)
Lee JH, Park YB, J. Electron. Mater., 38, 2194 (2009)
Zhang JS, Chan YC, Wu YP, XI HJ, Wu FS, J. Alloys Compd., 458, 492 (2008)
Bauer R, Fischer AH, Birzer C, Alexa L, Proc. 61st Electron. Comp. Technol. Conf. (Lake Buena Vista, FL: IEEE., 317 (2011)

[1] Directive 2002/95/EC on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment(RoHS), The European Parliament and of the Council of the European Union, Jan. (2003)

[2] European Union WEEE Directive, 3rd Draft, May. (2000)

[3] Suh D, Kim DW, Liu P, Kim H, Weninger JA, Kumar CM, Prasad A, Grimsley BW, Tejada HB, Mater. Sci. Eng. A, 460, 595 (2007)

[4] Kim DG, Kim JW, Ha SS, Noh BI, Koo JM, Park DW, Ko MW, Jung SB, J. Alloys Compd., 458, 253 (2008)

[5] Carson F, Lee SM, Vijayaragavan N, IEEE Compt, Packag. Manuf. Technol. (CPMT), 737 (2007)

[6] Koo JM, Lee CY, Jung SB, J. Microelectron. Packag. Soc., 14(4), 71 (2007)

[7] Chang D, Bai F, Wang YP, Hsiao CS, Proc. 6th Electron. Packag. Technol. Conf. (EPTC), IEEE, 149 (2004)

[8] Lee HK, Son SH, Lee HY, Jeon JM, J. Kor. Inst. Surf. Eng., 40(1), 32 (2007)

[9] Ding M, Wang G, Chao B, Ho PS, Su P, Uehling T, J. Appl. Phys., 99, 094906 (2006)

[10] Kim JM, Jeong MH, Yoo SH, Park YB, J. Electron. Mater., 41, 4 (2012)

[11] Kim JM, Jeong MH, Yoo SH, Lee CW, Park YB, Microelectronic Engineering, 89, 55 (2012)

[12] Kim SH, Kim JM, Yoo SH, Park YB, Curr. Appl. Phys., 13, S103 (2013)

[13] Kim SH, Kim JM, Yoo SH, Park YB, J. Microelectro. Packag. Soc., 19, 4 (2012)

[14] Leel JH, Park YB, J. Electron. Mater., 38, 10 (2009)

[15] JESD22-B117A (Solder Ball Shear), JEDEC Standard, Jul. (2006)

[16] Lim GT, Kim BJ, Lee KW, Kim JD, Joo YC, Park YB, J. Electron. Mater., 38, 2228 (2009)

[17] Lu YD, He XQ, En YF, Wang X, Zhung ZQ, Acta Mater., 57, 2560 (2009)

[18] Lin YH, Hu YC, Tsai CM, Kao CR, Tu KN, Acta Mater., 53, 2029 (2005)

[19] Lin YH, Tsai CM, Hu YC, Lin YL, Kao CR, J. Electron. Mater, 34, 27 (2005)

[20] Lee JH, Lim GT, Yang ST, Suh MS, Chung QH, Byun KY, Park YB, J. Kor. Phys. Soc., 54, 1784 (2009)

[21] Lee JH, Park YB, J. Electron. Mater., 38, 2194 (2009)

[22] Zhang JS, Chan YC, Wu YP, XI HJ, Wu FS, J. Alloys Compd., 458, 492 (2008)

[23] Bauer R, Fischer AH, Birzer C, Alexa L, Proc. 61st Electron. Comp. Technol. Conf. (Lake Buena Vista, FL: IEEE., 317 (2011)