PZT 세라믹 레조네이터 무연솔더 접합부의 열-기계적 피로 가속수명

홍원식; 박노창; 오철민; Won Sik Hong; No Chang Park; Chul Min Oh

Korean Journal of Materials Research, Vol.19, No.6, 337-343, June, 2009

DOI10.3740/MRSK.2009.19.6.337 Export Citation

PZT 세라믹 레조네이터 무연솔더 접합부의 열-기계적 피로 가속수명

Accelerated Thermo-Mechanical Fatigue Life of Pb-Free Solder Joints for PZT Ceramic Resonator

홍원식^†, 박노창, 오철민

전자부품연구원 고장물리연구센터

Won Sik Hong^†, No Chang Park, and Chul Min Oh

Physics-of-Failure Research Center, Korea Electronics Technology Institute, Gyeonggi, 463-816, Korea

E-mail:

In this study, we optimized Pb-free Sn/Ni plating thickness and conditions were optimized to counteract the environmental regulations, such as RoHS and ELV(End-of Life Vehicles). The B10 life verification method was also suggested to have been successful when used with the accelerated life test(ALT) for assessing Pb-free solder joint life of piezoelectric (PZT) ceramic resonator. In order to evaluate the solder joint life, a modified Norris-Landzberg equation and a Coffin-Manson equation were utilized. Test vehicles that were composed of 2520 PZT ceramic resonator on FR-4 PCB with Sn-3.0Ag-0.5Cu for ALT were manufactured as well. Thermal shock test was conducted with 1,500 cycles from (-40 ± 2)oC to (120 ± 2)oC, and 30 minutes dwell time at each temperature, respectively. It was discovered that the thermal shock test is a very useful method in introducing the CTE mismatch caused by thermo-mechanical stress at the solder joints. The resonance frequency of test components was measured and observed the microsection views were also observed to confirm the crack generation of the solder joints.

Keywords:solder joint;Pb-free;thermo-mechanical;resonator;life prediction

[References]

Ohno K, Motoyama A, Uodome H, Kuroi S, Matzusida Electron. Tech. Report, 35 (2003)
Hong WS, Kim WS, Park NC, Kim KB, J. Kor. Welding and Joining Soc., 25(2), 184 (2007)
Minomiya T, Sony Semiconductor/Quality and Reliability Handbook, 1st ed., p.136-150, Sony Co., Kanagawa Japan (2000). (2000)
JESD 94A, Application Specific Qualification Using Knowledge Based Test Methodology, JEDEC Standard, USA (2007). (2007)
Salmela O, IEEE Trans. Components and Packaging Tech., 30(4), 700 (2007)
Pan N, in Proceedings of the SMTA International Conference (2006) p.876. (2006)
Bartelo J, in Proceedings of the IPC International Conference of SMEMA Council APEX (2001) p.1. (2001)
Hong WS, Kim WS, Song BS, Kim KB, Korean J. Mater. Res., 17(3), 152 (2007)
Ryu D, Chang S, Microelectron. Reliability, 45, 611 (2005)
Hu JM, Barker D, Dasgupta A, Arora A, in IEEE Proceedings of the Annual Reliability And Maintainability Symposium. (1992) p.181 . (1992)
Lawless JF, Statistical Models and Methods for Lifetime Data, p.227, John Wiley & Sons, New York (1982). (1982)

[Referenced By]

[1] Ohno K, Motoyama A, Uodome H, Kuroi S, Matzusida Electron. Tech. Report, 35 (2003)

[2] Hong WS, Kim WS, Park NC, Kim KB, J. Kor. Welding and Joining Soc., 25(2), 184 (2007)

[3] Minomiya T, Sony Semiconductor/Quality and Reliability Handbook, 1st ed., p.136-150, Sony Co., Kanagawa Japan (2000). (2000)

[4] JESD 94A, Application Specific Qualification Using Knowledge Based Test Methodology, JEDEC Standard, USA (2007). (2007)

[5] Salmela O, IEEE Trans. Components and Packaging Tech., 30(4), 700 (2007)

[6] Pan N, in Proceedings of the SMTA International Conference (2006) p.876. (2006)

[7] Bartelo J, in Proceedings of the IPC International Conference of SMEMA Council APEX (2001) p.1. (2001)

[8] Hong WS, Kim WS, Song BS, Kim KB, Korean J. Mater. Res., 17(3), 152 (2007)

[9] Ryu D, Chang S, Microelectron. Reliability, 45, 611 (2005)

[10] Hu JM, Barker D, Dasgupta A, Arora A, in IEEE Proceedings of the Annual Reliability And Maintainability Symposium. (1992) p.181 . (1992)

[11] Lawless JF, Statistical Models and Methods for Lifetime Data, p.227, John Wiley & Sons, New York (1982). (1982)