이론분석에 의한 MEMS 소켓 핀의 스프링 상수 계산

배규식; 호광일; Kyoo-Sik Bae; Kwang-Il Ho

Korean Journal of Materials Research, Vol.18, No.11, 592-596, November, 2008

DOI10.3740/MRSK.2008.18.11.592 Export Citation

이론분석에 의한 MEMS 소켓 핀의 스프링 상수 계산

Computation of Spring Constants of MEMS Socket Pins by Theoretical Analysis

배규식, 호광일^{1, †}

수원대학교 전자재료공학과
¹수원대학교 기계공학과

Kyoo-Sik Bae, and Kwang-Il Ho^{1, †}

Department of Electronic Materials Engineering, The University of Suwon, Korea
¹Department of Mechanical Engineering, The University of Suwon, Korea

E-mail:

Spring constants (displacement per unit applied load) of MEMS socket pins of given structures were computed by theoretical analysis and confirmed by the finite element method (FEM). In the theoretical analysis, the displacement of pins was calculated based on the 2-dimensional bending theory of the curved beam. For the 3-dimensional modeling, CATIA was used. After modeling, the raw data were transferred to ANSYS, which was employed in the 3-dimensional analysis for the calculation of the stress and strain and loaddisplacement The theoretical analysis and the FEM results were found to agree, with each showing the spring constants as 63.4 N/m within a reasonable load range. These results show that spring constants can be easily obtained through theoretical calculation without resorting to experiments and FEM analysis for simple and symmetric structures. For the some change of shape and structural stiffness, this theoretical analysis can be applied to MEMS socket pins.

Keywords:MEMS socket pin;spring constant;theoretical analysis;bending theory;FEM

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[2] Chen ML, Tai CC, The 4th Int'l Symp. on Electronic Materials and Packaging, IEEE, 4-6 Dec,123. (2002)

[3] Langston N, Langston Jr N, Yao H, Advanced Packaging, 13(3), 1 (2004)

[4] Chowdhury S, Ahmadi M, Jullien GA, Miller WC, Circuit and Systems, 2002, ISCAS’02, Proceedings of the 2002 Int’l Symp., Vol. 1, 657 (2002). (2002)

[5] Itoh T, Kataoka K, Suga T, Sensors and Actuators A, 97, 462 (2002)

[6] Kim YM, Yu IS, Lee JH, KIEE Int'l Trans. on EA, 4-C(4), 149 (2004)

[7] Park SS, J. KIEE, 24(10), 45 (1997)

[8] Hormes J, Gottert J, Lian K, Desta Y, Jian L, Nucl. Instru. Methods Phys. Res. Sect. B, 199, 332 (2003)

[9] Baghbanan B, Erb U, Palumbo G, Phys. Stat. Sol. A, 203(6), 1259 (2006)

[10] Yim TH, Yoon SC, Kim HS, Mat. Sci. & Engr A, 449, 836 (2007)

[11] Cho HS, Hemker KJ, Lian K, Goettert J, Dirras G, Sensors and Actuators A, 103, 59 (2003)

[12] Seo MH, Hong HS, Jung WS, J. Mater. Res., 18(3), 117 (2008)

[13] Bedyk W, Niessner M, Schrag G, Wachutka G, Margesin B, Faes A, Sensors and Actuators A, 145, 263 (2008)

[14] Malucci R, IEEE-CHMT, 34(3), 399 (2001)

[15] Wu J, Pecht MG, 2004 Int'l IEEE Conf. on Asian Green Electronics, p.127-135 (2005). (2005)

[16] Dassault Systemes, CATIA Version 5.17, (2006). (2006)

[17] ANSYS, Inc., ANSYS(R) Release 11.0, (2005). (2005)