분말 응집도가 BaTiO3/에폭시 복합체의 유전특성에 미치는 영향

한정우; 김병국; 제해준; Jeong-Woo Han; Byung-Kook Kim; Hae-June Je

Korean Journal of Materials Research, Vol.18, No.10, 542-546, October, 2008

DOI10.3740/MRSK.2008.18.10.542 Export Citation

분말 응집도가 BaTiO3/에폭시 복합체의 유전특성에 미치는 영향

Effect of Degree of Particle Agglomeration on the Dielectric Properties of BaTiO3/Epoxy Composites

한정우, 김병국, 제해준^†

한국과학기술연구원 에너지재료연구단

Jeong-Woo Han, Byung-Kook Kim, and Hae-June Je^†

Center for Energy Materials Research, KIST, Seoul 136-791, Korea

E-mail:

BaTiO3/epoxy composites can be applied as the dielectric materials for embedded capacitors. The effects of the degree of BaTiO3 particle agglomeration on the dielectric properties of BaTiO3/epoxy composites were investigated in the present study. The degree of particle agglomeration was controlled by the milling of the agglomerated particles. The size and content of the agglomerated BaTiO3 particles decreased with an increase in the milling time. The dielectric constants and polarizations of BaTiO3/epoxy composites abruptly decreased with the increase of the milling time. It was concluded that the dielectric constants and polarizations of BaTiO3/epoxy composites decreased as the degree of particle agglomeration decreased. The degree of agglomeration of BaTiO3 particles turned out to be a very influential factor on the dielectric properties of BaTiO3/epoxy composites.

Keywords:BaTiO3/epoxy composites;agglomeration;dielectric constant;capacitor

[References]

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Cho SD, Lee JY, Paik KW, J. Micro. & Packaging Soc., (in Korean), 8(4), 59 (2001)
Lee HY, J. Micro. ＆ Packaging Soc., (in Korean), 9(2), 55 (2002)
Bhattacharya SK, Tummala RR, J. Mater. Sci : Materials in Electronics, 11(3), 253 (2000)
Rao Y, Ogitani S, Kohl P, Wong CP, J. Appl. Polym. Sci., 83(5), 1084 (2002)
Rao Y, Wong CP, J. Appl. Polym. Sci., 92(4), 2228 (2004)
Xu J, Bhattacharya SK, Pramanik P, Wong CP, J. Electron. Mater., 35(11), 2009 (2006)
Je HJ, Kim DW, Park JG, Kim BK, Submitted in J. Appl. Polym. Sci., (2008). (2008)
Mitoff SP, Advances in Materials Research, 3rd ed.,p.305, ed. Herman H, John Wiley, New York, USA,(1968). (1968)
Robertson J, Varlow BR, IEEE Trans. Dielectr. Electr. Insul., 12(4), 779 (2005)

[Referenced By]

[1] Prymark J, Fundamentals of Microsystems Packaging, p.420, ed. Tummala RR, Mcgraw-Hill Book Company, New York, USA, (2001). (2001)

[2] Cho SD, Lee JY, Paik KW, J. Micro. & Packaging Soc., (in Korean), 8(4), 59 (2001)

[3] Lee HY, J. Micro. ＆ Packaging Soc., (in Korean), 9(2), 55 (2002)

[4] Bhattacharya SK, Tummala RR, J. Mater. Sci : Materials in Electronics, 11(3), 253 (2000)

[5] Rao Y, Ogitani S, Kohl P, Wong CP, J. Appl. Polym. Sci., 83(5), 1084 (2002)

[6] Rao Y, Wong CP, J. Appl. Polym. Sci., 92(4), 2228 (2004)

[7] Xu J, Bhattacharya SK, Pramanik P, Wong CP, J. Electron. Mater., 35(11), 2009 (2006)

[8] Je HJ, Kim DW, Park JG, Kim BK, Submitted in J. Appl. Polym. Sci., (2008). (2008)

[9] Mitoff SP, Advances in Materials Research, 3rd ed.,p.305, ed. Herman H, John Wiley, New York, USA,(1968). (1968)

[10] Robertson J, Varlow BR, IEEE Trans. Dielectr. Electr. Insul., 12(4), 779 (2005)