전기화학적 방법을 통한 3차원 금속 다공성 막의 제조

강대근; 허정호; 신헌철; Dae-Keun Kang; Jung-Ho Heo; Heon-Cheol Shin

Korean Journal of Materials Research, Vol.18, No.3, 163-168, March, 2008

DOI10.3740/MRSK.2008.18.3.163 Export Citation

전기화학적 방법을 통한 3차원 금속 다공성 막의 제조

Fabrication of Three-Dimensional Network Structures by an Electrochemical Method

강대근, 허정호, 신헌철^†

부산대학교 재료공학부

Dae-Keun Kang, Jung-Ho Heo, and Heon-Cheol Shin^†

School of Materials Science and Engineering, Pusan National University, Busan 609-735, Korea

E-mail:

The morphology of three-dimensional (3D) cross-linked electrodeposits of copper and tin was investigated as a function of the content of metal sulfate and acetic acid in a deposition bath. The composition of copper sulfate had little effect on the overall copper network structure, whereas that of tin sulfate produced significant differences in the tin network structure. The effect of the metal sulfate content on the copper and tin network is discussed in terms of whether or not hydrogen evolution occurs on electrodeposits. In addition, the hydrophobic additive, i.e., acetic acid, which suppresses the coalescence of evolved hydrogen bubbles and thereby makes the pore size controllable, proved to be detrimental to the formation of a well-defined network structure. This led to a non-uniform or discontinuous copper network. This implies that acetic acid critically retards the electrodeposition of copper.

Keywords:network structure;electrodeposition;copper;tin

[References]

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Shin HC, Dong J, Liu ML, Adv. Mater., 15(19), 1610 (2003)
Shin HC, Liu ML, Adv. Funct. Mater., 15(4), 582 (2005)
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Craig VSJ, Ninham BW, Pashley RM, Nature, 364, 317 (1993)
Deschenes LA, Zilaro P, Muller LJ, Fourkas JT, Mohanty U, J. Phys. Chem. B, 101(30), 5777 (1997)
Deschenes LA, Barrett J, Muller LJ, Fourkas JT, Mohanty U, J. Phys. Chem. B, 102(26), 5115 (1998)
Paunovic M, Schlesinger M, Fundamentals of Electrochemical Deposition, 2nd ed., p.209, Wiley-Interscience, New Jersey, USA (2006). (2006)
White JH, Abruna HD, J. Electroanal. Chem., 300, 521 (1991)
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[Referenced By]

[1] Long JW, Rhodes CP, Young AL, Rolison DR, Nano Letters, 3, 1155 (2003)

[2] Sakamoto JS, Dunn B, J. Mater. Chem., 12, 2859 (2002)

[3] Ranganathan S, McCreery R, Majji SM, Madou M, J. Electrochem. Soc., 147(1), 277 (2000)

[4] Shin HC, Dong J, Liu ML, Adv. Mater., 15(19), 1610 (2003)

[5] Shin HC, Liu ML, Adv. Funct. Mater., 15(4), 582 (2005)

[6] Shin HC, Liu M, Chem. Mater., 16(25), 5460 (2004)

[7] Fontana MG, Corrosion Engineering, 3rd ed., p.445, McGraw-Hill, New York, USA (1987). (1987)

[8] Jones DA, Principles and Prevention of Corrosion, 2nd ed., p.75, Prentice Hall, New Jersey, USA (1996). (1996)

[9] Craig VSJ, Ninham BW, Pashley RM, J. Phys. Chem., 97, 10197 (1993)

[10] Craig VSJ, Ninham BW, Pashley RM, Nature, 364, 317 (1993)

[11] Deschenes LA, Zilaro P, Muller LJ, Fourkas JT, Mohanty U, J. Phys. Chem. B, 101(30), 5777 (1997)

[12] Deschenes LA, Barrett J, Muller LJ, Fourkas JT, Mohanty U, J. Phys. Chem. B, 102(26), 5115 (1998)

[13] Paunovic M, Schlesinger M, Fundamentals of Electrochemical Deposition, 2nd ed., p.209, Wiley-Interscience, New Jersey, USA (2006). (2006)

[14] White JH, Abruna HD, J. Electroanal. Chem., 300, 521 (1991)

[15] Herrero E, Abruna HD, Langmuir, 13(16), 4446 (1997)

[16] Fukuda T, Aramata A, J. Electroanal. Chem., 467(1-2), 112 (1999)