AlN 세라믹의 hot pressing에 사용되는 Y2O3 및 Al2O3 소결조제의 효과

공만식; 홍현선; 이성규; 서민혜; 정항철; Man-Sik Kong; Hyun-Seon Hong; Sung-Kyu Lee; Min-Hye Seo; Hang-Chul Jung

Korean Journal of Materials Research, Vol.17, No.10, 560-566, October, 2007

DOI10.3740/MRSK.2007.17.10.560 Export Citation

AlN 세라믹의 hot pressing에 사용되는 Y2O3 및 Al2O3 소결조제의 효과

Effects of Y2O3 and Al2O3 Addition on the Properties of Hot Pressed AlN Ceramics

공만식, 홍현선^†, 이성규¹, 서민혜, 정항철

고등기술연구원 플랜트엔지니어링센터
¹-

Man-Sik Kong, Hyun-Seon Hong^†, Sung-Kyu Lee¹, Min-Hye Seo, and Hang-Chul Jung

Plant Engineering Center, Institute for Advanced Engineering, Yongim, 449-863, Korea
¹Division of Chemical and Materials Engineering, Ajou Universty, Suwon, 443-749, Korea

E-mail:

AlN plates were fabricated by hot pressing at 1700-1900 oC using yttria and alumina (3 and 10 um particle size) powders as additives and characterized: density, thermal conductivity, transverse rupture strength, and grain size measurement by SEM and EDS. Density values of 3.31-3.34 g/cm3 are largely attributed to hot pressing of powder mixtures in carbon mold under N2 atmosphere which caused effective degree of oxygen removal from yttrium-aluminate phase expected to form at 1100oC. The grain size of hot pressed AlN was almost homogeneous, with size approximately from 3.2 to 4.0um after hot pressing. Al2O3 powder of 3 particle size resulted in better transverse rupture strength and finer grain size compared to um Al2O3 powder. The thermal conductivity of AlN ranged between 83-92.7w/m.K and decreased with Al2O3 addition. Fine grain size is preferred for better mechanical properties and thermal conductivity.

Keywords:AlN (Aluminum Nitride);Hot pressing;Sintering;Thermal conductivity;Transverse Rupture Strength

[References]

Hsieh CY, Lin CN, Chung SL, Cheng J, Agrawal DK, J. Eur. Ceram, Soc., 27, 343 (2007)
Xu X, Zhuang H, Li W, Xu S, Zhang B, Fu S, Mat. Sci. Eng. A, 342, 104 (2003)
Khor KA, Cheng KH, Yu LG, Boey F, Mat. Sci. Eng. A, 347, 300 (2003)
Slack GA, Schowalter LJ, Morelli D, Freitas JA, J. Cryst. Growth, 246(3-4), 287 (2002)
Qiao L, Zhou H, Xue H, Wang S, J. Eur. Ceram. Soc., 23, 61 (2003)
Du S, Liu Z, Li L, Gui Z, Mater. Lett., 25, 105 (1995)
Kume S, Yasuoka M, Lee SK, Kan A, Ogawa H, Watari K, J. Eur. Ceram. Soc., 27, 2967 (2007)
Boey F, Tok AIY, Lam YC, Chew SY, Mat. Sci. Eng. A, 335, 281 (2002)
Klimera A, Raether F, Ruska J, J. Eur. Ceram. Soc., 27, 1419 (2007)
Kim YW, Park HC, Lee YB, Oh KD, Stevens R, J. Eur. Ceram. Soc., 21, 2383 (2001)
Boey F, Cao L, Khor KA, Acta Mater., 49, 3117 (2001)
Reed JS, Principles of Ceramic Processing, Second ed., p. 513, John Wiley & Sons, Inc., New York, USA, (1995) (1995)
Nakano H, Watari K, Urabe K, J. Eur. Ceram. Soc., 23, 1761 (2003)
Qiao L, Zhou H, Chen K, Fu R, J. Eur. Ceram. Soc., 23, 1517 (2003)

[Referenced By]

[1] Hsieh CY, Lin CN, Chung SL, Cheng J, Agrawal DK, J. Eur. Ceram, Soc., 27, 343 (2007)

[2] Xu X, Zhuang H, Li W, Xu S, Zhang B, Fu S, Mat. Sci. Eng. A, 342, 104 (2003)

[3] Khor KA, Cheng KH, Yu LG, Boey F, Mat. Sci. Eng. A, 347, 300 (2003)

[4] Slack GA, Schowalter LJ, Morelli D, Freitas JA, J. Cryst. Growth, 246(3-4), 287 (2002)

[5] Qiao L, Zhou H, Xue H, Wang S, J. Eur. Ceram. Soc., 23, 61 (2003)

[6] Du S, Liu Z, Li L, Gui Z, Mater. Lett., 25, 105 (1995)

[7] Kume S, Yasuoka M, Lee SK, Kan A, Ogawa H, Watari K, J. Eur. Ceram. Soc., 27, 2967 (2007)

[8] Boey F, Tok AIY, Lam YC, Chew SY, Mat. Sci. Eng. A, 335, 281 (2002)

[9] Klimera A, Raether F, Ruska J, J. Eur. Ceram. Soc., 27, 1419 (2007)

[10] Kim YW, Park HC, Lee YB, Oh KD, Stevens R, J. Eur. Ceram. Soc., 21, 2383 (2001)

[11] Boey F, Cao L, Khor KA, Acta Mater., 49, 3117 (2001)

[12] Reed JS, Principles of Ceramic Processing, Second ed., p. 513, John Wiley & Sons, Inc., New York, USA, (1995) (1995)

[13] Nakano H, Watari K, Urabe K, J. Eur. Ceram. Soc., 23, 1761 (2003)

[14] Qiao L, Zhou H, Chen K, Fu R, J. Eur. Ceram. Soc., 23, 1517 (2003)