오존과 초음파를 이용한 실리콘 웨이퍼의 Post Sliced Cleaning

최은석; 배소익; Eun-Suck Choi; So-Ik Bae

Korean Journal of Materials Research, Vol.16, No.2, 75-79, February, 2006

DOI10.3740/MRSK.2006.16.2.075 Export Citation

오존과 초음파를 이용한 실리콘 웨이퍼의 Post Sliced Cleaning

Post Sliced Cleaning of Silicon Wafers using Ozone and Ultrasound

최은석^†, 배소익

(주)실트론 기술연구소

Eun-Suck Choi^†, and So-Ik Bae

Leading Project Team, R&D Center, Siltron Inc.,, 283, Imsoo-Dong, Gumi, Gyung-Buk, 730-724, Korea

E-mail:

The effect of ozone and/or ultrasound treatments on the efficiency of slurry removal in post sliced cleaning (PSC) of silicon ingot was studied. Efficiency of slurry removal was evaluated as functions of time, temperature and surfactant with DOE (Design of Experiment) method. Residual slurries were observed on the wafer surface in case of cleaning by ozone or ultrasound separately. However, a clean wafer surface was appeared when cleaned with ozone and ultrasound simultaneously. It has found that cleaning time was the main effect among temperature, time and surfactant. Elevated temperature, addition of surfactant and high ozone concentration helped to accelerate efficient removal of slurry. The improvement of removal efficiency seems to be related to the formation of more active OH radicals. The highly cleaned surface was achieved at 10 wt% ozone, 1 min and 10 vol% surfactant with ultrasound. Application of ozone and ultrasound might be a useful method for PSC process in wafer cleaning.

Keywords:PSC;ozone;ultrasound;time;pH

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[1] Kern W, Handbook of Semiconductor Wafer Cleaning Technology, p. 3, Noyes Publications, New Jersey (1993) (1993)

[2] Ohmi T, Isagawa T, Kogure M, Imaoka T, J. Electrochem. Soc., 140(3), 804 (1993)

[3] De Smedt F, De Gendt S, Heyns MM, Vinckier C, J. Electrochem. Soc., 148(9), G487 (2001)

[4] Ojima S, Kubo K, Kato M, Toda M, Ohmi T, J. Electrochem. Soc., 144(4), 1482 (1997)

[5] Alessaridri M, Bellandi E, Pipia F, Cazzaniga F, Wolke K, Schenkl M, Solid State Phenomena, 65-66, 27 (1999)

[6] Noda S, Miyamoto M, Horibe H, Oya I, Kuzumoto M, Kataoka T, J. Electrochem. Soc., 150(9), G537 (2003)

[7] Noda S, Kawase K, Horibe H, Kuzumoto M, Kataoka T, J. Electrochem. Soc., 152(1), G73 (2005)

[8] Park MS, Yang MK, Korean J. Sanitation, 17(2), 1 (2002)

[9] Huh M, Lim JS, Kim BG, J. Korean Environ. Sci. Soc., 7(4), 493 (1998)

[10] Kang JW, Choi HC, Jung SW, Choie SI, J. Kor. Soc. Environ. Eng., 15(3), 537 (1993)

[11] Nam SN, Koh CI, Kang JW, J. Kor. Solid Wastes Eng. Soc., 17(6), 705 (2000)

[12] Kang JW, Lee KH, Koh CI, J. Kor. Soc. Environ. Eng., 19(11), 1389 (1997)

[13] Kang JW, J. Environ. Hi-tech., 1, 5 (1994)

[14] DICER, DICER Techlnfo, 3(8), 398 (2004)

[15] Huh YJ, Lee CJ, Korea Patent, Pub, No. 10-1999-000441 (1999)